Used AMAT / APPLIED MATERIALS Endura 5500 #9101660 for sale

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ID: 9101660
Wafer Size: 8"
Vintage: 1997
MOCVD System, 8" Process: one Magnetron was Cu Gasses: Ar, N2, O2 for process (2) Standard body chambers (2) Wide body chambers (1) TxZ chamber with no source lid and partial CVD gas box parts Standard body chambers: No adapter or source lids (no magnetrons) Wide body chambers: (1) Dish target magnetron source (one missing) H2O Cooled (2) Narrow body loadlocks (2) Stnd clamped heater for standard body chambers (2) HTHU heaters for wide body chambers (1) TxZ heater All cryos are standard Endura CTI onboards Currently crated in a warehouse 1997 vintage.
AMAT / APPLIED MATERIALS / AKT Endura 5500 is a state-of-the-art low-pressure chemical vapor deposition (LPCVD) reactor designed to meet today's performance requirements in a variety of research and manufacturing applications. Using patented "High-Performance" technology, this energy efficient equipment provides a secure, repeatable and reliable environment. The modular design allows the reactor to be configured to the specific needs of an application. The design incorporates powerful "controlled environment" robotics ensuring accurate, repeatable and efficient substrate loading and handling. AKT Endura 5500 employs efficient thermal management technologies for uniform, repeatable process results. The flexible process architechture is capable of supporting a variety of materials such as single and multi-layer metals, oxides, nitrides, silicon, and silicon dioxide. The LPCVD environment produces uniform high-performance thin film layers uniformly and rapidly across a variety of wafer sizes. The process area is designed to be isolated from external conditions and highly repeatable, using dynamic chamber pressure controllers and effective heat management. The onboard temperature range in AMAT ENDURA 5500 extends from 20C to 1000C for precise deposition rates and uniform layer thickness. The system is designed to meet the specific customer demands, allowing for precise temperature control in a given range. The high-precision automation platform allows for smaller or larger substrate sizes to be loaded and handled during processing for increased flexibility. APPLIED MATERIALS ENDURA 5500 unit also includes a variety of integrated tools, such as an advanced process monitoring machine for preventing particle contamination and a powerful material handling tool. The process monitoring asset features convenient alerts, allowing you to quickly make adjustments when process parameters are outside of established limits. The integrated material handling model delivers accurate, repeatable delivery of process materials. The equipment also includes ultra-low particulate spraying technology for minimizing the spread of hazardous particles, ensuring a clean, safe substrate. Additionally, Endura 5500 offers increased reliability and repeatability using automated control systems. Overall, AMAT Endura 5500 is a powerful and reliable LPCVD chamber designed to optimize a wide range of processes for precise control, increased throughput and efficiency. With its integrated security, dynamic temperature control, advanced process monitoring and intuitive material handling system, the unit delivers precise, safe and repeatable thin film deposition.
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