Used AMAT / APPLIED MATERIALS Endura 5500 #9142611 for sale

AKT AMAT / APPLIED MATERIALS / AKT Endura 5500 is a highly advanced chemical vapor deposition (CVD) processing tool designed for use in semiconductor device fabrication lab environments. This 600mm tool utilizes the hot-wall CVD method, which works by introducing reactant gases into the process chamber that interact to form the desired product layer on the substrate material. AKT Endura 5500 reactor offers a modular design that allows researchers to customize the equipment to suit their needs. The reactor operates off of a four-chamber design built around a central substrate holder, allowing researchers to generate multiple layers of film on a single substrate in a single cycle. AMAT ENDURA 5500 provides outstanding levels of control with a highly efficient and optimized heating system, enabling it to achieve temperatures up to 1100 °C. It also features advanced flow control that helps achieve accurate and repeatable flow rates of vapors to ensure uniform coverage of the substrate material. Furthermore, the tool's advanced temperature control unit helps ensure uniform temperature distribution within the process chamber. This aids in maintaining consistent temperature uniformity across substrates, which is essential to creating high-quality film layers. When used for deposition applications, APPLIED MATERIALS ENDURA 5500 is capable of generating multiple film layers at once, greatly increasing the throughput of the lab. Thanks to its powerful supervisory control machine, it's also easy to monitor process conditions, making APPLIED MATERIALS Endura 5500 suitable for both manual and automatic operation. In addition, the tool is highly flexible and can be used for a variety of deposition applications including dielectric, metal etch, and integrated passivation layers. In sum, AMAT ENDURA 5500 is an advanced CVD processing tool designed to enable semiconductor device production through high-quality and high-precision deposition of film layers. This 600mm tool provides excellent temperature control and highly accurate flow control, which helps ensure uniform coverage of the substrate material. It also features a powerful supervisory control asset and is highly flexible thanks to its modular design, allowing researchers to customize the model to their specific needs.