Used AMAT / APPLIED MATERIALS Endura 5500 #9177283 for sale

Name: AMAT / APPLIED MATERIALS Endura 5500
Brand: AMAT / APPLIED MATERIALS
SKU: 9177283
Availability: SoldOut

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

Tap to zoom

Photo Used AMAT / APPLIED MATERIALS Endura 5500 For Sale

Sold

Reactors

Manufacturer

AMAT / APPLIED MATERIALS

Model

Endura 5500

ID: 9177283

Wafer Size: 8"

System, 8" Wafer shape: SNNF Chamber 1: SIP Cu Process 1: Low temperature Cu Chamber 2: Wide body Process 2: TTN Chamber 3: Wide body Process 3: TTN Chamber 4: SIP Cu Process 4: Low temperature Cu Chamber A: Pass through Chamber B: Cooldown Chamber E: Orient / Degas Chamber F: Orient / Degas Transfer robot type: HEWLETT-PACKARD Transfer robot blade: Metal Buffer robot type: HEWLETT-PACKARD Buffer robot blade: Metal Loadlock type: Narrow BD with tilt out Signal tower: 4 Color R/G/Y/B MF Facilities: Bottom System umbilical: 25 ft EMIs: Turn to release No facility power (UPS) No loadlock pump Loadlock slit valve O-Ring: Viton (Black) Heat exchanger 1: NESLAB Heat exchanger 2: M-Pack Hard drive: SCSI (2) CRTs No GEM No OTF Main AC box: 480 V type, wide type Chamber A: Chamber type: Pass through Gas valves: Fujakin Slit valve o-ring: Viton (Black) Clear chamber lid Chamber B: Chamber type: Cooldown Gas valves: Fujakin Slit valve o-ring: Viton (Black) Heater / Cathode cooling: PCW Clear chamber lid Chamber 1: Chamber type: SIP Cu Manometer config: Single Manometer 1: 100 mTorr Slit valve o-ring: Viton (Black) Shutter option Chamber process: Low temperature Cu Lid type: SIP Source RF Gen / DC Supply 1: ADVANCED ENERGY MDX-L6 Susceptor / Pedestal: Low temperature ESC Wall cooling: PCW Heater / Cathode cooling: M-Pack Gate valve position: 3-Pos Process kit type: SIP Chamber pump: Enhanced 3 phase cryo Magnet number: 0010-21676 Gas 1: MFC Size: N2 100 Sccm Gas name: AR MFC Type: STEC 7440 MFC Number: MFC16 Gas stick configuration: Single Chamber 2: Chamber type: Wide body Manometer config: Single Manometer 1: 100 mTorr Slit valve O-Ring: Viton (black) Shutter option Chamber process: TTN Lit type: G12 RF Gen / DC Supply 1: ADVANCED ENERGY MDX-650 HiZ Susceptor / Pedestal: A101 Heater / Cathode cooling: PCW Gate valve position: 3-Pos Process kit type: A101 Chamber pump: Enhanced 3 phase cryo Magnet number: 0010-21844 Chamber 3: Chamber type: Wide body Manometer config: Single Manometer 1: 100 mTorr Slit valve o-ring: Viton (black) Shutter option Chamber process: TTN Lit type: G12 RF Gen / DC Supply 1: ADVANCED ENERGY MDX-650 HiZ Susceptor / Pedestal: A101 Heater / Cathode cooling: PCW Gate valve position: 3-Pos Process kit type: A101 Chamber pump: Enhanced 3 phase cryo Magnet number: 0010-21844 Chamber 4: Chamber type: SIP Cu Manometer config: Single Manometer 1: 100 mTorr Slit valve o-ring: Viton (black) Shutter option Chamber process: Low temperature Cu Lit type: G12 RF Gen / DC Supply 1: ADVANCED ENERGY MDX-L6 Susceptor / Pedestal: Low temperature ESC Heater / Cathode cooling: NESLAB III Process kit type: SIP Chamber pump: Enhanced 3 phase cryo Magnet number: 0010-21676 Power supply: 208 VAC, 3 Phase, 5 wire, 400 A.

Read More Close

AKT/AMAT / APPLIED MATERIALS / AKT Endura 5500 is a reactor equipment designed for advanced etching applications. This tool is capable of reaching extremely high throughputs, featuring a twin process chamber design which allows simultaneous operation of both etch and clean processes. AKT Endura 5500 has a large process window and is able to support 2.6-um devices with low temperature etch and clean. AMAT ENDURA 5500 is equipped with patent-pending DC pulsed plasma source for high selectivity etching, as well as a large area plasma that allows for higher etch rate on certain films. This system is able to achieve repeatable etch rate uniformity of <2% across wafers with a high etch uniformity over the entire substrate. APPLIED MATERIALS Endura 5500 also boasts a robust process control unit that allows for real-time recipes and monitoring of parameters such as substrate temperature, etch rate, and etch uniformity. This reactor machine also features an integrated cluster tool that provides a cluster solution for non-stop automated end-to-end processing. Endura 5500 has a broad range of flexible substrate transfer space as well as cassette to cassette, substrate to cassette, and direct cassette to cassette transfers. It also has an Advanced Process Control Module (APCM) that allows users to accurately monitor, analyze, and modify their process recipes. AMAT Endura 5500 is equipped with an on-board monitoring and control asset, making it a reliable and stable platform for demanding processes. This control model features PID control and feedback deviation monitoring. PID control allows for accurate and repeatable process stability while feedback deviation monitoring ensures the process runs in a pre-defined range. In addition, AMAT / APPLIED MATERIALS / AKT ENDURA 5500 has a low maintenance design, with over 200 points of diagnostics. This includes an integrated preventative maintenance equipment, advanced process diagnostics, and remote monitoring features. This helps reduce downtime, as it allows users to quickly identify and solve problems. Overall, AKT ENDURA 5500 is an advanced reactor system designed for etching applications. It features a twin process chamber design, a DC pulsed plasma source, a control unit for recipe adjustment, an advanced cluster machine, and low maintenance design. These features make APPLIED MATERIALS ENDURA 5500 highly efficient and reliable, making it a great choice for cutting-edge etching processes.