Used AMAT / APPLIED MATERIALS Endura 5500 #9241831 for sale
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ID: 9241831
Wafer Size: 6"
Vintage: 2000
System, 6"
Load lock chamber:
LLC Type: Narrow body
Indexer without rotation
Wafer mapping
CH Vent: Slow / Fast vent
No wafer slide out detector
Buffer chamber:
Robot unit: HP
Blade type: Metal
Upper & lower motor
(2) Gate valves
Cryo pump: 3 Phase
(7) Wafer sensors
Transfer chamber:
Robot unit: HP
Blade type: Metal
Upper & lower motor
(2) Gate valves
Cryo pump: 3 Phase
(6) Wafer sensors
Chamber A: Pass through
Chamber B: Cool down
Chamber A / B:
Lid type: Clear plastic
Wafer lift
Wafer lift hoop
No TC monitor
Chamber E / F: Oreintor degas
Degas lamp module
Wafer lift
Wafer lift hoop
Wafer chuck
Orientor controller PCB
Laser tub missing
Laser CCD array PCB
No TC
No TC amp
Chamber 1: PVD Wide body
Source assy: 11.3"
Source bracket kit
Coh ti adaptor plate
Wafer lift: Clamp
Heater: Clamp
Heater water box: Clamp
Manometer: MKS 100 mT
Ar Backside
(2) Gate valves
Ion gauge
Shutter option
Cryo pump: 3 Phase
Heater type: Clamp
Chamber harness
Chamber inter-connect PCB
Chamber process gas line
Chamber vent line
Chamber source water manifold
Chamber pneumatic 1/8 poly line set
Chamber 2: PVD Wide body
Source assy, 11.3"
Source bracket kit
Adaptor plate: WB to STD 13"
Wafer lift: Clamp
Heater: Clamp
Heater water box: Clamp
Manometer: MKS 100 mT
Ar Backside
(2) Gate valves
Ion gauge
Shutter option
Cryo pump: 3 Phase
Heater type: Clamp
Chamber harness
Chamber inter-connect PCB
Chamber process gas line
Chamber vent line
Chamber source water manifold
Chamber pneumatic: 1/8 Poly line set
Chamber 3 / 4: PVD Wide body
Source assy: 11.3"
Source bracket kit
Adaptor plate: WB to STD 13"
Wafer lift: Clamp
Heater: Clamp
Heater water box: Clamp
Manometer: MKS 100 mT
Convectron gauge
Ar Backside
(3) Gate valves: PVD
Ion gauge
Shutter option
Cryo pump: 3 Phase
Heater type
Chamber harness
Chamber inter-connect PCB
Chamber process gas line
Chamber vent line
Chamber source water manifold
Chamber pneumatic: 1/8 Poly line set
Chamber C: PCII Etch
Resonator
Pedestal lift
MKS Manometer
Convectron gauge
Ion gauge
Turbo pump
Wafer lift
RF Match
No process kit
Chamber 1,2,3,4 & C:
Gas panel assy
MFC: (STEC 4400)
MFC Down steam valve
Manual shut off valve
MFC Control cable
MFC Inter-connect PCB
Sub-module:
Cryo compressor: CTI 9600 & 8500
(2) Cryo controllers: 3 Phase
Chiller: NESLAB III
Vacuum pump
System pump: BOC EDWARDS QDP40
PCII Pump: BOC EDWARDS QDP40 + MB250
System rack: VEM
SBC
Video
SEI
(12) DIO
AI
(2) AO
(3) Opto PCB
(2) AI Mux
Cryo temp /AI MUX
(4) Steppers PCB
TC Gauge PCB
(2) Ion gauge PCB
(4) Invertron gauge PCB
OMS PCB
Hard disk
FD Disk
(4) 2-Phase HTR lift drivers
(6) 5-Phase robot drives
RF Rack:
RF/DC Rack
Turbo controller
(5) ISO AMP
(4) DC/RF Generator interlocks PCB
DC Power supply
DC Generator: Model ADVANCE ENERGY MDX-L series
RF Generator CPS 1001
RF Generator RFPPLF10A
AC Rack type: 480 VAC, 3 Phase, 4+1 Wire with transformer
DC Power supply: +5 VDC / +24 VDC
DC Power supply: +/-15 VDC / +/-12 VDC
2000 vintage.
AMAT / APPLIED MATERIALS / AKT Endura 5500 is a gas-essential, in-situ etch reactor for use in semiconductor processing and tooling applications. It is designed to provide optimal uniformity and reliability for etching applications using a combination of inert or reactive gases and an optimized substrate-to-antenna design. AKT Endura 5500 features a dual-substrate capable reactor, with both a lower chamber and an upper chamber. The lower chamber is optimized for high-speed etch and deposition processes, while the upper chamber offers a larger process window for etch and deposition processes requiring more precise control. AMAT ENDURA 5500 is equipped with a low-noise, low-power, actively cooled plasma to enable reliable operation for a wide variety of etch and deposition processes. The built-in dynamic pressure control allows for adjustment of RF power to maintain optimal process uniformity and reliability. APPLIED MATERIALS Endura 5500 utilizes an ultrasonic frequency-conversion technology to ensure uniform heating of the substrate, and uniform etching of polymers and other organic material. The broadband capability of APPLIED MATERIALS ENDURA 5500 reactor enables users to maximize throughput and utilization of their tools while simultaneously optimizing their performance. AMAT / APPLIED MATERIALS / AKT ENDURA 5500 also features a variety of advanced process monitoring systems, including optical emission spectroscopy, thermal imaging, and optical microscopy analysis. With AKT ENDURA 5500, users are able to monitor critical process parameters in real time and make adjustments as needed, enabling better process control and optimization. The system is easy to use, highly accurate, and offers a wide range of programmability for direct control and monitoring of all major process parameters. For safe and reliable operation, AMAT Endura 5500 also includes a built-in safety system, with safety interlocks and protective hardware in order to protect operators and equipment from unexpected hazards. It includes a variety of motion and thermal control systems, allowing users to configure it to their specific needs. Endura 5500 also offers an automated maintenance system to make sure that it is kept in top shape and ready for optimal etching and deposition operations.
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