Used AMAT / APPLIED MATERIALS Endura 5500 #9257162 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 9257162
Sputtering system, 6"
Load lock chamber:
LLC Type: Narrow body
Indexer without rotation
Wafer mapping
CH Vent: Slow / Fast vent
No wafer slide out detector
Buffer chamber:
AGILENT / HP / HEWLETT-PACKARD Robot
Upper and lower motors
(2) Gate valves
Cryo pump: 3 Phase
(7) Wafer sensors
Transfer chamber:
AGILENT / HP / HEWLETT-PACKARD Robot
Upper and lower motors
(2) Gate valves
Cryo pump: 3 Phase
(6) Wafer sensors
Chamber A: Pass through
Chamber B: Cool down
Chamber A / B:
Lid type: Clear plastic
Wafer lift
Wafer lift hoop
No TC monitor
Chamber E / F: Orienter degas
Degas lamp module
Wafer lift
Wafer lift hoop
Wafer chuck
Orienter controller PCB
Laser CCD array PCB
No TC
No TC amp
Chamber 1: PVD Wide body
Source assy: 11.3"
Source bracket kit
COH TI Adapter plate
Wafer lift: Clamp
Heater: Clamp
Heater water box: Clamp
MKS 100 mT Manometer
Ar Backside
(2) Gate valves
Ion gauge
Shutter option
Cryo pump, 3 Phase
Heater type: Clamp
Chamber harness
Chamber inter-connect PCB
Chamber process gas line
Chamber vent line
Chamber source water manifold
Chamber pneumatic 1/8 poly line set
Chamber 2: PVD Wide body
Source assy, 11.3"
Source bracket kit
Adapter plate: WB to STD 13"
Wafer lift: Clamp
Heater: Clamp
Heater water box: Clamp
MKS 100 mT Manometer
Ar Backside
(2) Gate valves
Ion gauge
Shutter option
Cryo pump: 3 Phase
Chamber harness
Chamber inter-connect PCB
Chamber process gas line
Chamber vent line
Chamber source water manifold
Chamber pneumatic: 1/8 Poly line set
Chamber 3 / 4: PVD Wide body
Source assy: 11.3"
Source bracket kit
Adapter plate: WB to STD 13"
Wafer lift: Clamp
Heater: Clamp
Heater water box: Clamp
MKS 100 mT Manometer
Convectron gauge
Ar Backside
(3) Gate valves: PVD
Ion gauge
Shutter option
Heater type
Chamber harness
Chamber inter-connect PCB
Chamber process gas line
Chamber vent line
Chamber source water manifold
Chamber pneumatic: 1/8 Poly line set
Chamber C: PCII Etch
Resonator
Pedestal lift
MKS Manometer
Convectron gauge
Ion gauge
Turbo pump
Wafer lift
RF Match
No process kit
Chamber 1, 2, 3, 4, C:
Gas panel assy
MFC: STEC 4400
MFC Down steam valve
Manual shut off valve
MFC Control cable
MFC Inter-connect PCB
Sub-module:
CTI-CRYOGENICS 9600 Cryo compressor
(2) Cryo controllers: 3 Phase
NESLAB III Chiller
Vacuum pump
System pump: BOC EDWARDS QDP40
PCII Pump: BOC EDWARDS QDP40 + MB250
System rack: VEM
SBC
SEI
(12) DIO
AI
(2) AO
(3) Opto PCB
(2) AI MUX
Cryo temp / AI MUX
(4) Steppers PCB
TC Gauge PCB
(2) Ion gauges PCB
(4) Invertron gauges PCB
OMS PCB
Hard Disk Drive (HDD)
Floppy Disk Drive (FDD)
(4) HTR Lift drivers, 2-Phase
(6) Robot drives, 5-Phase
RF Rack:
RF / DC Rack
(5) ISO Amp
(4) DC / RF Generator interlocks PCB
DC Power supply
ADVANCED ENERGY MDX-L12 DC Generator
CPS 1001 RF Generator
RFPPLF10A RF Generator
Missing parts:
Metal blades
Laser tubes
Heater type: Clamp
Cryo pump, 3 Phase
Turbo controller
RF / DC Rack
ADVANCED ENERGY MDX-L Series DC Generator
RF Generator, 13.56 MHz / 400 kHz
Power supply:
AC Rack type: 480 VAC, 3 Phase, 4+1 Wire with transformer
DC Power supply: +5 VDC / +24 VDC
DC Power supply: +/-15 VDC / +/-12 VDC
2000 vintage.
AMAT / APPLIED MATERIALS / AKT Endura 5500 is a semiconductor based high-density plasma reactor for Wet Etching. This reactor is designed to provide superior uniformity in production and engineering of advanced integrated circuits. It offers a wide range of plasma resource options, as well as state-of-the-art process control and monitoring capabilities. AKT Endura 5500 action system is designed to reduce process deviation, while providing improved performance and yield. AMAT ENDURA 5500 is designed as having gallium nitride (GaN) etch processes. It features a diode-pumped pulsed-plasma source module, process control module, and etch module. The pulsed-plasma source is a high-pressure, high-efficiency device which enables fine control of plasma parameters for improved etching performance. The process control module offers flexibility for various production requirements. It is capable of controlling multi-number of gas lines and delivery valves, as well as easy real-time switching of multiple etch parameters, such as: gas pressure, platen voltage, etch time, platen voltage bias, chamber temperature, and others. The etch module is designed to offer flexibility, acceleration of etch process, and uniformity of etch patterns. It features a replicable platen design to reduce potential process deviation, while also enabling specific platen designs for special etch processes. AKT ENDURA 5500 is a highly reliable reactor with low maintenance requirements. It is capable of achieving low defect rate, while maintaining high product yields. The reactor is designed for ease of use, with intuitive user-interface, and easy, step-by-step process support. It provides process engineers and production personnel with valuable feedback on the process results, which enables faster cycle-times and improved yield. This reactor is also designed for long-term stability and repeatability of process parameters for production and engineering. Overall, AMAT Endura 5500 is a highly advanced, reliable, and easy-to-use high-density plasma reactor for Wet Etching. It is designed to provide improved process control, uniform etch patterns, and improved product yields. It enables easier, faster, and repeatable processes, while also providing engineers and production personnel with valuable feedback on the process results.
There are no reviews yet