Used AMAT / APPLIED MATERIALS Endura 5500 #9258406 for sale

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ID: 9258406
Wafer Size: 8"
Vintage: 2000
PVD Sputtering system, 8" Wafer shape: SNNF VHP Robot Chamber configuration: Chamber A: Pass chamber Chamber B: Cooldown chamber Chamber 2 and 3: HP TxZ Chamber with gas panel Chamber 4: IMP Ti Chamber Chamber C: Pre-clean II Chamber Chamber D: Pre-clean II Chamber Chamber E and F: Degas Chamber Loadlock configuration: Widebody loadlock Auto rotation Cassette type, 8" Mapping function: WWM Fast vent option SMIF Interface Mainframe configuration: Buffer robot type: HP+ Buffer robot blade: Metal blade XFER Robot type: VHP Lid hoist Status light tower Remote monitor: Stand alone Missing parts: Chamber 2 and 3: Turbo pump Turbo pump controller Chamber lid Process kits and heater Chamber 4: Cryo pump Source assy Magnet B101 Heater Lift assy RF Generator Chamber C: Turbo pump Turbo pump controller 400K RF Generator Chamber D: Turbo pump Turbo pump controller 400K RF Generator 13.56M RF Generator Mainframe: Buffer Transfer chamber cryo pump Rack electrical configuration: SBC VGA Board OMS / SEI Electrical configuration: Line voltage: 208 V RF I and II Rack: Line voltage: 208 V Compressor electrical configuration: Line voltage: 208 V 9600 Compressor, 3 Phase UPS Interface AC Rack: Line voltage: 480 V Full load current: 400 A Frequency: 60 Hz CE Marked 2000 vintage.
AMAT / APPLIED MATERIALS / AKT Endura 5500 reactor is an advanced deposition equipment featuring single-wafer processes for semiconductor processing. The 5500 is designed to maximize throughput, yield, and feature fidelity through proven process and automation technologies. With state-of-the-art control systems and uniformity values consistently below 0.2%, the 5500 is well-suited to handle the most demanding process applications, including the formation of advanced interconnects, memory, and optoelectronic devices. The 5500 utilizesinductively coupled plasma (ICP) sources to provide a source of energetic ions and radicals that facilitate ion implantation, deposition, sputtering, and etching processes within the chamber. The ICP sources are coupled with comprehensive, on-board process control systems to provide precise control over plasma and substrate conditions. The 5500 features an automated substrate transfer system, which enables accurate, repeatable, and reliable wafer processing. Additionally, a series of hydrocarbon traps and pellitors help maintain optimal process conditions and protect the unit from contamination. The 5500 has up to ten controllable process gas lines to optimize process parameters such as ion implantation and sputter deposition rates. The 5500 also features multiple Cassette-to-Cassette (C2C) stations, allowing for up to eight source wafer lots to be processed concurrently. This allows for high throughput with minimal waste, as well as the capability to switch wafer lot processing in seconds. The machine also features an integrated reactive sputtering module that utilizes Ultraviolet Enhanced Deposition (UED) techniques to enable fully self-formed photonic features. To ensure uniformity, the 5500 utilizes industry-leading, proprietary algorithms to optimize uniformity across the wafer plane. The tool also features a built-in Analysis Tool, allowing for unprecedented visibility into the uniformity and process conditions across the wafer. This tool allows for rapid process integration and optimization, with improved turnaround times compared to traditional methods. The 5500 offers exceptional throughput with industry leading uniformity and repeatability, paired with advanced process control and process-enabling features. With its combination of features and capabilities, the 5500 provides an excellent solution for critical deposition processes used in semiconductor device fabrication.
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