Used AMAT / APPLIED MATERIALS Endura 5500 #9258409 for sale
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ID: 9258409
Wafer Size: 8"
PVD Sputtering system, 8"
Wafer shape: SNNF
Chamber:
Chamber A: Pass chamber
Chamber B: Cooldown chamber
Chamber 1: AlCu NB
Chamber 2: TiN WB
Chamber 3: AlCu NB
Chamber 4: TiN WB
Chamber E and F: Degas chamber
Loadlock:
Widebody loadlock
Auto rotation
Cassette type, 8"
Mapping function: WWM
Vent type: Variable speed
Fast vent option
SMIF Interface
Mainframe:
HP Buffer robot
Buffer robot blade: Metal blade
HP+ XFER Robot
Buffer robot blade: Metal blade
LID Hoist
Light tower
Stand along remote monitor
Missing parts:
Mainframe:
Buffer / Transfer chamber cryo
Pump / Robot arm
Chamber 1:
Cryp pump
Chamber 2:
Cryo pump
Heater assembly
Shutter assembly
Chamber 3 and 4: Cryo pump
Loadlock: LLB Index
Rack electrical: PCB
Rack electrical:
Line voltage: 208 V
RF I and II Rack:
Line voltage: 208 V
Compressor electrical:
Line voltage: 208 V
9600 Compressor: 3 Phase
No UPS interface
NESLAB Electrical configuration
AC Rack:
Line voltage: 480 V
Full load current: 400 A
Frequency: 60 Hz.
AMAT / APPLIED MATERIALS / AKT Endura 5500 is a deposition equipment designed for supplying and reducing harsh chemicals to the surface of a substrate. It is a large scale, process machine that is used for vacuum and etch applications. The Engineers at AKT have designed the system to provide high levels of reliability, performance and cost-effectiveness. It is often used in the production of memory chips, microelectronic components, and in the processt of chemical mechanical polishing. The main components of AKT Endura 5500 include a reactor chamber, a plasma source, and a series of vacuum pumps. The reactor chamber is an isolated space where the substrate is located. It is heated to a temperature ranging from 80 to 200° Celsius, depending on the type of deposition being performed. The reactor chamber is equipped with lift pins for easy loading and unloading of substrates. The exothermic chemical process is achieved by introducing gases and controlling the timing and pressure. In addition, the unit has a digital control panel which allows users to set and control multiple, valve, and pressure parameters. AMAT ENDURA 5500 plasma source produces a low-energy plume, which is generated by a protected ceramic faceplate with multiple gas sources. The plasma source is capable of controlling the deposition rate of the material and ensuring uniformity and consistency across the substrate. The vacuum pumps are used for the evacuation and preservation of the vacuum state within the chamber. They are also responsible for ensuring material transport to and from the target surface. The pumps are equipped with automatic machine pressure control and filtering capability. AMAT / APPLIED MATERIALS / AKT ENDURA 5500 tool offers precise control of the deposition process, allowing for engineered materials with a wide range of physical properties to be processed and tailored by the user. In addition, the machine is equipped with advanced monitoring systems and is capable of controlling and monitoring several parameters such as substrate temperatures, pressure levels, and thickness of deposited material. The asset also provides fault detection and alert features to allow the user to detect and address typical errors easily. Overall, ENDURA 5500 provides efficient and reliable production for a number of materials processing applications. It offers high levels of reliability, performance, and flexibility, allowing the user to customize and control their manufacturing process.
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