Used AMAT / APPLIED MATERIALS Endura CL #293752937 for sale

Name: AMAT / APPLIED MATERIALS Endura CL
Brand: AMAT / APPLIED MATERIALS
SKU: 293752937
Availability: InStock

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Reactors

Manufacturer

AMAT / APPLIED MATERIALS

Model

Endura CL

ID: 293752937

Wafer Size: 12"

Vintage: 2001

System, 12" Chamber E/F: STD Degas Chamber D: PC-XT Chamber 1: IMP Chamber 2/3: TxZ (2) Scanners Generator rack Distribution rack AC Rack Monitor missing Front monitor Flex controller: VME Type (2) PODs Light curtain: FABS Type(JAPAN) Signal tower: 3 Colors Aligner type: Single axis stand alone Passthrough: Dummy 12-Slot Missing parts: KENSINGTON Robot Robot controller 1/2 FI HDD/FDD CD ROM FI CPU Board (2) Degas Chambers (E/F) Chamber type: STD Heater Type Cryo pump missing Chambers A&B: Chamber A: Passthrough Chamber B: Cooldown Lid type: Clear Lid Buffer and transfer: Robot type: VHP Robot (12) Slit V/V Assemblies (12) Slit V/V Doors Missing parts: Cryo Pump SBC452 Board P-III CPU Board Buffer Interlock Board FE HDD RT HDD FE/RT FDD VHP Robot cover Chamber 1: Process type: Vectra IMP IMP Adaptor Weldment type: STD Controller tower type: CL STD Type Lid hoist type: Gas spring type Heater type: B101 Gate V/V type: 3 Position Shitter option: CL STD Type Missing parts: Coil match Bias match Cryo pump Coil matching box: 2 MHz Bias matching box Shutter driver Wafer lift driver Bias pedestal RF power cable Ion/Convectron gauge controller Pedestal driver Chamber 2: Process Type: TxZ Gas box type: TFTE DLI Type Gas delivery & exhaust: TFTE Type TurboVac 361C Pump Heater type: TxZ STD Turbo isolation valve: Angle valve Baratron gauge: 2T/1000Torr MFC: (5) STEC Missing parts: Throttle valve MFC and valve for purge module Chamber feedthrough DI/O Board TDMAT Bottle Purge module bracket Lid CVGGF Chamber 3: Process Type: TxZ Gas box type: TFTE DLI Type Gas delivery & exhaust: TFTE Type TurboVac 361C Pump Purge module: BOT/EDGE/BS Baratron gauge 2T/1000Torr MFC: (5) STEC Missing parts: Throttle valve MFC and valve for purge module Chamber feedthrough TxZ Heater & Lift pin Purge module bracket Chamber D: Process Type: PC-XT Resonator type: Fan resonator Controller tower type: CL STD Type TurboVac 1000C Pump Gate V/V Type: 2Pos Bias match option: 13.56 MHz MFC: (2) STEC Missing parts: Analog board Bias matching box Pedestal RF Power Pedestal lift assembly Lift/Pedestal driver RGA Manual valve PC-XT Pedestal DI Max Cooler: DI Max Chiller: Steelhead 1 Compressor missing Racks: Distribution rack (2) Generator racks AC Rack Accessories: TDMAT auto re-fill gas cabinet Abatement device 1/2 UPS Umbilical cable Pump frame System earthquake prevention belt brackets INFICON RGA Accessories AC Rack DI/O board missing IMP CDX-1250 Bias generator missing Power supply: Chamber 1: Dual Pinnacle 10 kW+6 kW HFV-8000 5 kW Chamber 2, 3: COMDEL CLX-2500 Chamber D: ENI GMW-25A 2 MHz ENI GHW-12A 123.56 MHz Missing pumps: SWLL Degas RPC 2001 vintage.

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AMAT / APPLIED MATERIALS Endura CL is a diffusion systems high-performance wafer processing reactor. This specialized equipment is used to deposit, etch, and strip thin layers of materials from the surface of a semiconductor wafer. Its chemical-mechanical polishing (CMP) capabilities allow for the uniform planarization of features and surfaces even at the nanoscale level. AMAT Endura CL reactor comes standard with the Chroma 1400 wafer feeder and the SpeedTec EBR-2000 power supply, both of which help ensure uniform deposition and patterning. The reactor also features a 120 kV E-gun, an automated gas handling and injection equipment, and a real-time temperature measurement and management system, allowing for precision and repeatability when processing wafers. In addition, the unit has a built-in fault-tolerance program that helps anticipate and correct processing errors in real-time. APPLIED MATERIALS Endura CL reactor is designed specifically for metallization applications, and its high-powered deposition capabilities can process up to 50 wafers per hour. The reactor features a triple-vacuum environment with an Ultra-High Vacuum (UHV) chamber that eliminates cosmic radiation, induced current, and particle contamination. This tight vacuum environment allows for greater control over reaction conditions, resulting in a precisely manipulated, consistent film appearance and uniformity. The compact design of Endura CL reactor allows it to fit easily into cleanroom environments. Its low-maintenance catalytic chemical vapor deposition (CVD) process allows for the uniform deposition of dielectric and metallization films in a fast and repeatable manner. The reactor also features a number of different process-specific configurations, allowing for a wide variety of wafer processing applications. AMAT / APPLIED MATERIALS Endura CL reactor is backed by AMAT exemplary customer service and maintenance programs, which ensure that the machine receives the necessary support and technical expertise to keep it running efficiently. This piece of high-performance semiconductor equipment is an essential tool for those looking to deposit, etch, and strip thin layers of material from the surface of a wafer. Its advanced features allow for the uniform planarization of features and surfaces even at the nanoscale level.