Used AMAT / APPLIED MATERIALS Endura CL #293757041 for sale

ID: 293757041
Wafer Size: 12"
Vintage: 2009
PVD System, 12" Does not include Hard Disk Drive (HDD) 2009 vintage.
AMAT / APPLIED MATERIALS Endura CL is a plasma enhanced chemical vapor deposition (PECVD) reactor, which is a high-end, high-performance deposition equipment. This system is designed to produce thin films used in the semiconductor and other industries. It is a substrate-based vapor deposition technology, which is typically used to deposit oxide, nitride, polysilicon, metal and other semiconductor materials for a range of applications. AMAT Endura CL utilizes a thermal evaporator with a dual longitudinal magnetron, and is equipped with a low-pressure capacitively coupled plasma (CPL) source to enable atomic layer deposition (ALD) and other precision deposition applications. The unit also features a subatmospheric cold-wall chamber for deposition in the temperature range of 100°C and 300°C to increase deposition rate while maintaining a low substrate temperature. Through its two-step process, APPLIED MATERIALS Endura CL has the ability to create a variety of complex structures such as heterostructures, tailored thickness geometries and internal stress gradients. With this capability, customers are able to pair CPL and ALD in a single reactor for optimal performance. The machine also offers an automated control tool to simplify recipes and relax the optimization process while achieving high deposition repeatability. With sophisticated integrated software and hardware capabilities, the asset is designed to facilitate ease of use and yield improvements. Additionally, an onboard diagnostics model handles preventive maintenance to reduce downtime and prevent unnecessary service requests. Endura CL is designed to provide increased productivity, equipment reliability and process flexibility for customers' production needs in the semiconductor industry. The integration of the two deposition technologies helps customers reduce time to market for their products by combining, optimizing and controlling the parameters of two distinct deposition techniques. In addition, customers can benefit from high throughput and low cost-of-ownership due to AMAT / APPLIED MATERIALS Endura CL
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