Used AMAT / APPLIED MATERIALS Endura CL #9251713 for sale

AMAT / APPLIED MATERIALS Endura CL is an advanced deposition reactor that is used to deposit a variety of thin films comprising of metals and complex organic compounds. It is equipped with an integrated chamber design, which is very advantageous for the applications for which it is designed. AMAT Endura CL employs a unique process chamber, allowing for the use of multiple offsets to ensure optimal uniformity and accuracy of the deposition rates across the substrate. The process chamber is fully enclosed with a glass lid and provides a uniform and contamination-free environment. APPLIED MATERIALS Endura CL possesses several advanced features, including a high temperature process capability, enabling deposition at up to 1000°C. This provides higher deposition temperature, uniformity, layer thickness and rate control, as well as improved step coverage and improved throughput. Additionally, Endura CL features innovative and user programmable advanced deposition recipes, allowing for complex thickness to be achieved in a single cycle. Moreover, AMAT / APPLIED MATERIALS Endura CL is capable of running multiple recipes simultaneously, allowing for the deposition of multiple layers of materials of varying thicknesses in a single cycle. This reduces the need for additional processing steps and can significantly reduce the deposition time. AMAT Endura CL is equipped with an atom beam source for enhanced deposition control, which ensures consistent epitaxial growth and uniform thin film deposition over the substrate. It also employs a multi-zone hydrodynamic addressing equipment that provides uniform gas distribution across the entire process chamber. This improves efficiency, repeatability and productivity of the system. APPLIED MATERIALS Endura CL has been designed with a low deposition rate capability, allowing for the deposition of layers with thicknesses as low as a few nanometers. In summary, Endura CL is an advanced deposition reactor which offers superior precision, uniformity and accuracy of deposition rates for a range of materials. It features a unique process chamber, high temperature capabilities, atom beam source and multi-zone hydrodynamic addressing unit. The machine can be programmed for complex multi-cycle depositions and is capable of controlling deposition rates as low as few nanometers. This makes AMAT / APPLIED MATERIALS Endura CL an ideal choice for nanoscale film depositions and the precise control of process parameters.