Used AMAT / APPLIED MATERIALS Endura CL #9281790 for sale

AMAT / APPLIED MATERIALS Endura CL is a highly sophisticated deposition tool engineered to provide advanced metallization and dielectric conformal coatings. This machine is part of the Endura family of deposition systems designed to enable the cost-effective development of cutting-edge devices used in a variety of industries including microelectronics, automotive, optics, and medical technology. Using the latest advances in high-performance thin film deposition technology, AMAT Endura CL enables the creation of the most efficient multi-layer systems for the patterning, packaging, integration, imaging, and inspection of substrates with unparalleled precision and speed. This equipment offers a high degree of flexibility in substrate and target materials, making it suitable for applications involving a wide range of processes such as electroplating, physical vapor deposition (PVD), and chemical vapor deposition (CVD). APPLIED MATERIALS Endura CL is also capable of creating three-dimensional, micron-scale conformal coatings on substrates and can be programmed to interleave deposition layers for finer feature resolution than ever before achievable. Endura CL has been designed to offer high performance in the most demanding processing environments. Its plasma-assistedprocessing chamber is based on a closed-loop system that allows for timed-pulse control over the endpoint. This makes for precision substrate cleaning and the reliable operation of temperatures ranging from room temperature to over 10,000°C.The chamber also helps to minimize particlenumber and reduce threshold voltage shift caused by undesired substrata contamination. AMAT / APPLIED MATERIALS Endura CL is equipped with an integrated substrate loader with up to 120 wafers in the unit, allowing for fast and accurate substrate exchange. Operator control is provided with a 25" touch screen computer console with full mouse, keyboard, and foot pedal control. This machine also offers a comprehensive suite of integrated process control reporting tools, enabling automated substrata pre- and post-processing inspection, providing immediate feedback on performance. For additional process features, AMAT Endura CL can be armed with a variety of accessories such as a nitrogen bubbler for enhancing deposition rate and uniformity or a high-energy beam deposition gun for easily depositing nanostructure and nanoscale coatings. APPLIED MATERIALS Endura CL also comes with a number of automated user-friendly control options to help maximize throughput and reduce mistakes. Furthermore, a unique Accelerator Technology Control Module is also available to provide increased process control precision. Endura CL is one of the most advanced deposition systems available today, enabling precise coating stability over extended periods of time and substrate uniformity for a variety of applications. With its advanced features and superior capability, AMAT / APPLIED MATERIALS Endura CL is ideal for those looking for superior performance in advanced thin film deposition.