Used AMAT / APPLIED MATERIALS Endura II Aluminum Interconnect #293813004 for sale

AMAT / APPLIED MATERIALS Endura II Aluminum Interconnect Reactor is a plasma-based etching equipment designed to etch aluminum films with a high degree of uniformity across large wafer sizes. This system is capable of producing precise and high-resolution features without generating any damaging stress or contamination in the aluminum film. The Endura II reactor uses a sophisticated ultra-high-vacuum (UHV) environment and a power supply in the range of 20discharges per second to create a high-quality etching unit. The Endura II reactor is designed to handle a wide variety of aluminum interconnets, with both single-layer and double-layer structures. To achieve consistent etch rates and uniformity, the Endura II can tune the discharge power, voltage, and frequency. The machine can also be easily adjusted to optimize for different structural and compositional layers. The Endura II also features advanced wafer control and alignment technology to ensure that the wafer stays in the desired position and the process is under control. The Endura II reactor is built for high productivity and low cost of ownership. It incorporates cost-saving features such as automated loading/unloading, low-level maintenance requirements, and an improved wafer-handling mechanism. It is designed to provide high yields with minimal downtime and maintenance cost requirements. The Endura II reactor is backed by AMAT advanced technologies and comprehensive services. This includes simulated advanced process solutions and a comprehensive promise monitoring program to provide customers with complete control over the etching process. The Endura II reactor is a reliable and efficient dielectric etching option for manufacturers of aluminum interconnects.