Used AMAT / APPLIED MATERIALS Endura II #293587508 for sale

AMAT / APPLIED MATERIALS Endura II
ID: 293587508
Wafer Size: 12"
PVD System, 12".
AMAT / APPLIED MATERIALS / AKT Endura II reactor is a state-of-the-art chemical vapor deposition system that provides a powerful and precise platform for performing a wide range of chemical reactions and processes. This reactor is a low-cost, non-thermal means of introducing and controlling gas species in a chemical environment. It has advanced features such as chemical vapor deposition, dielectric thin film deposition, thin film etching, and chemical gas etching. AKT Endura II reactor uses a variety of chemical species that are injected into the reaction chamber, combining with the gaseous precursors to form thin films or etch patterns. A microwave generator is used to generate plasma in the reactor at low pressure, facilitating chemical reactions. In the case of thin-film deposition, the reactants are typically polymeric or silane (SiH4). The substrate is placed in the center of the reactor and the reactive species are injected into the chamber from outlets located along the reactor perimeter. The substrate is then exposed to both thermal and chemical energy in order to promote thin film deposition. For chemical etching, a variety of etchants such as hydrofluorocarbons (HFCs), perfluorocarbons (PFCs) and fluorine-based plasmas are used in the process. Etchants can be combined to achieve greater depth of etch. The plasma is generated by a magnetic field, generated by varying the electric current in the coil. This produces a plasma that accelerates the chemical etching of the substrate. AMAT Endura II reactor is equipped with multiple sensors that allow precise control of the reaction conditions and process parameters. These sensors are used to measure the anode-cathode gap, heater temperature, deposition rate, gas level, process gas pressure and temperature, as well as being able to detect and alarm in case of an anomaly. APPLIED MATERIALS Endura II reactor is a highly precise and cost-effective solution for process engineers. It provides the ability to rapidly and accurately prepare the conditions for thin film deposition and etching, making it ideal for use in a wide range of industries. The system is flexible and versatile, allowing for high-quality films for applications ranging from solar cells to flat panel displays.
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