Used AMAT / APPLIED MATERIALS Endura II #293616137 for sale

AMAT / APPLIED MATERIALS Endura II is a specialized plasma etch reactor specifically designed for high-volume manufacturing applications. This highly reliable equipment is capable of efficiently etching a wide range of materials with unmatched precision. AMAT Endura II is a single-wafer batch configuration and is ideally suited for feature sizes ranging from submicron to several microns. The heart of the system is its highly efficient multi-frequency pulsing plasma source, which allows for both high etch rates and superior etching selectivity. This revolutionary patented plasma source uses programmable frequency modulation to precisely control etch depth and feature resolution while retaining the optimal process window. This ultra-fast and precise etching makes APPLIED MATERIALS Endura II one of the most sought after systems on the market. The flexibility and power of Endura II come in part from its advanced AMAT / APPLIED MATERIALS Endura II Process Control and Analysis Software. This user-friendly software suite allows for sophisticated event control, process monitoring, and automated analysis of the etching process. AMAT Endura II also utilizes an advanced, single entrapment transport unit that moves wafers into and out of the etching chamber. The machine is extremely robust, providing dependable and reliable operation even under the most demanding conditions. Additionally, APPLIED MATERIALS Endura II includes environmental sensors that monitor the etch pressurized chamber, ensuring the stability and repeatability of the etching process. The robust performance of Endura II does not end with the etch chamber. AMAT / APPLIED MATERIALS Endura II includes an advanced hierarchical workflow that provides automated process control and improved work queue management. This powerful automation feature allows for faster loading and unloading of wafers, reducing both downtime and variation in the etching process. AMAT Endura II is an advanced reactor that offers unmatched etching precision and throughput. Its sophisticated multi-frequency pulsing plasma source provides reliable, repeatable etch depth and feature resolution, while APPLIED MATERIALS Endura II Process Control and Analysis Software provides comprehensive event control, process monitoring and analysis. Additionally, the tool's advanced, single entrapment transport asset and work queue management features provide faster, efficient and robust operation. Thanks to all of these features, Endura II is an ideal solution for high-volume etching jobs with strict dimensional control requirements.