Used AMAT / APPLIED MATERIALS Endura II #293640653 for sale

AKT/AMAT / APPLIED MATERIALS / AKT Endura II is a batch-type reaction chamber with plasma-enhanced chemical vapor deposition (PECVD) capabilities designed to deposit a variety of thin films, including dielectrics, metals, and semiconductors. This reactor operates in both atmospheric- and vacuum-mode conditions, making it suitable for a range of applications. AKT Endura II consists of a reaction chamber, an RF power supply (for CCVD processes), a bias power supply, a gas sequencing equipment, a vacuum system, and a data acquisition unit. AMAT Endura II reaction chamber is made of stainless steel and is equipped with off-axis funneled inlets for uniform reactant distribution.It has a volume of 20.7 liters and pressure range of 0.001 to 1.00 Torr with a base pressure of better than 3x10-6 Torr. Its maximum temperature capability is 600°C with a 6 kW regulated power supply. The RF power supply is capable of producing frequencies from 0.3-300 MHz, with a maximum power output of 1000 kW. In addition, 4 programmable power sources allow for independent control of anode and cathode power. The bias power supply is designed to extend process control beyond the conventional four-quadrant operation to eight-quadrant capability.The bias power supply offers independent control of the bias probe, cathode, and anode. Endura II utilizes a six-gas sequencer which controls up to six gas inlets, enabling complex processes to be run with multiple gas precursors. The vacuum machine consists of a booster pump and a turbomolecular high vacuum pump, producing up to 8e-7 Torr base pressure. To monitor process data, APPLIED MATERIALS Endura II is equipped with a data acquisition tool for gathering, processing, and displaying operational data. The data acquisition asset includes Status/Alarm monitoring, SPC Software, and integrated Control/Power/Biasing functions. Overall, AMAT/AMAT / APPLIED MATERIALS / AKT Endura II is a high performance processed tool equipped with a range of features to deliver precise control of thin film deposition. Its atmospheric- and vacuum-mode capability, RF power supply, bias power supply, gas sequencing model, vacuum equipment and data acquisition system, combine to provide a reliable and efficient unit for many thin film deposition processes.