Used AMAT / APPLIED MATERIALS Endura II #293811396 for sale

AMAT / APPLIED MATERIALS / AKT Endura II is a chemical vapor deposition (CVD) reactor designed to perform a variety of advanced thin film depositions. The equipment combines the proven performance of the Endura platform with the large-scale manufacturing capabilities of AKT. AKT Endura II is constructed with a planar design to ensure the highest levels of process uniformity and repeatability. AMAT Endura II's stainless steel, inert gas, and valve systems are designed to enable precision control of the temperature, pressure, and flow rate in the reactor chamber. The system is based on advanced, patented plasma generating techniques to enable precise production of epitaxy, nitride and oxide layers, as well as other complex thin film depositions. Endura II features a gas delivery unit that allows for delivery of mixed or multiple gases to the reactor chamber. It is capable of depositing materials such as silicon, III-V compounds, transition metals, rare-earths, oxides, nitrides, organics, and polymers with excellent control and uniformity. Utilizing the low energy plasma option, the machine is well suited to depositing soft films such as dielectrics and passivation layers. The tool is fully automated and features a self-diagnostics asset to detect potential problems with the process. APPLIED MATERIALS Endura II can be configured with a range of options including heated endwalls, multiple wafer handling, wafer transfer loadlocks, and cassette/tower support for wafer transport. These options reduce substrate loading time and increase the overall throughput of the model. AMAT / APPLIED MATERIALS / AKT Endura II is designed for easy integration into a cleanroom environment and is capable of running in either batch or continuous production. The equipment is constructed using a modular design that allows for easy expansion and customization of the process. AKT Endura II offers enhanced control of the deposition process, offering excellent yields and repeatability. The system provides a reliable and cost-effective platform for large-scale thin film deposition applications.