Used AMAT / APPLIED MATERIALS Endura II #9231975 for sale

AMAT / APPLIED MATERIALS / AKT Endura II Reactor is a next-generation semiconductor process tool designed for precision processing of advanced technology nodes. It delivers superior performance and uniformity on the most demanding 3D NAND applications in the industry. This reactor is designed to maximize throughput, ensure precision, and minimize defects while reducing cycle times. The reactor supports integrated process flows that enable faster and more accurate etch, deposition, and annealing recipes. AKT Endura II Reactor features a compact, one-piece, tool-free design that allows for quick and seamless installation. This open architecture design simplifies the installation of additional hardware as required to meet customer needs. The reactor delivers performance advantages with its robust linear drive technology providing highly reliable operation. Additionally, it features a unique erosion equipment, which enables higher etch precision over substrates of varying thickness and composition. The reactor features an advanced process control that enables precise temperature and pressure control, resulting in superior process stability and repeatability. In addition, AMAT Endura II Reactor features an integrated chamber system, known as the Adaptively Controlled Chamber. This unit eliminates additional losses, resulting in improved runoff rates, improved layer deposition uniformity, and a reduction in particle transfer. The Adaptively Controlled Chamber helps to reduce costs associated with higher chemistries, while increasing process uptime. Endura II Reactor is designed for maximum thermal uniformity and excellent particle control. This is accomplished through an innovative heat transfer design that utilizes advanced plasma flow and field physics simulations. The reactor features a robust plasma heating machine, which utilizes advanced heating technologies to effectively manage the effects of uneven surface temperature gradients, resulting in higher uniformity across the wafer. The reactor also utilizes proprietary gas-flow control technology to help maintain optimal process performance with minimal downtime. APPLIED MATERIALS Endura II Reactor is fully compliant with the most advanced technology nodes and manufacturing procedures. The reactor is capital equipment that provides extremely high up-time and reliable processes. This cost effective tool is ideal for advanced process technologies, including 3D NAND, molding, dielectric deposition, reactive ion etching, and metal deposition.