Used AMAT / APPLIED MATERIALS Endura II #9258545 for sale

AKT/AMAT / APPLIED MATERIALS / AKT Endura II is a high throughput PECVD (Plasma Enhanced Chemical Vapor Deposition) reactor used to deposit thin films on a wide range of materials. This equipment is well-suited for thin film deposition processes, such as passivation, anti-reflective coatings, and thin dielectrics. It is capable of depositing high quality, uniform layers of material to the surface of most demanding products with high throughput and reproducible results. AKT Endura II features a low pressure, high vacuum chamber that is capable of processing materials from one wafer size up to 300mm diameter. The chamber is partitioned into separate zones for dedicated process components and utilizes a coaxial showerhead for uniform distribution of plasma and gas inside the reactor. It also incorporates off-axis capability for low temperature anneal and etch process steps. AMAT Endura II uses a high power radio frequency generator to create an inductively coupled plasma (ICP) source in the chamber. The ICP source heats the reactant gases to several thousand degrees Celsius which is required to produce the desired deposition results. The generation of the plasma is controlled by a Pulse Modulated Control (PMC) system, which enables repeatable deposition processes with reliable uniformity across the substrate. The unit also has the option for in-situ focused ion beam (FIB) for process monitoring, as well as the ability to add additional source gases for more diverse deposition applications. Endura II also offers a variety of process control functionalities such as reactive gas monitoring, gas flow control, pressure sensors, and temperature control systems to ensure consistent deposition processes with improved yield and reliability. Additionally, the machine utilizes an automated wafer handling tool with easy loading and unloading of wafers to ensure continuous material processing. In summary, AMAT/APPLIED MATERIALS Endura II is a high throughput PECVD asset capable of producing high quality layers of material, with repeatable and reliable uniformity. This model is equipped with a number of different features, such as off-axis capability, an inductively coupled plasma source, a pulse modulated control equipment, in-situ FIB, and automated wafer handling system. This unit is an ideal solution for R&D and production environments requiring rapid thin-film processing capabilities with great accuracy and reliability.