Used AMAT / APPLIED MATERIALS Endura II #9270654 for sale

AMAT / APPLIED MATERIALS Endura II
ID: 9270654
Wafer Size: 12"
Vintage: 2019
System, 12" 2019 vintage.
AMAT / APPLIED MATERIALS / AKT Endura II is a reactor used in semiconductor fabrication. It is the latest, and most advanced, model of the Endura series of reactors, developed and manufactured by AKT and AMAT. AKT Endura II is a plasma-enhanced chemical vapor deposition (PECVD) reactor, which is used to deposit thin film coatings on semiconductor substrates. The reactor features a unique design, with the Process Chamber and turbo pump integrated within the reactor body. This allows for a compact and efficient design, which requires minimal installation area. AMAT Endura II is designed to deposit a range of different coatings, using different chemistries and filtration media, on semiconductor substrates. It also offers a wide range of process gas chemistries. The reactor can handle substrates up to 6 inches (15.2 cm) in size and has a maximum processing rate of 2000 wafers/hour. Endura II also features advanced software equipped for remote system monitoring. It ensures process control and optimization by providing detailed reports and alerts. Additionally, the reactor is compatible with a range of post-process measurements, including ellipsometry, reflectometry, and x-ray reflectometry. APPLIED MATERIALS Endura II is powered by an integrated pump, process chamber, and other components, connected by a computer-controlled, automated algorithm. This ensures the best temperature and deposition uniformity while reducing the risk of thermal damage to substrates. The reactor also allows for fast and effective cleaning of the process chamber, so that the process is continuously optimized. AMAT / APPLIED MATERIALS / AKT Endura II is the ideal choice for semiconductor applications requiring precise deposition and process control. It constitutes a cost-effective, reliable, and technically advanced solution for those in need of a versatile, high-quality PECVD reactor.
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