Used AMAT / APPLIED MATERIALS Endura II #9274818 for sale

AMAT / APPLIED MATERIALS / AKT Endura II is an advanced plasma etching reactor designed to perform large scale etching and etching-related operations on a wide range of materials and substrates. The reactor is designed to be used in high-volume industrial processes, as well as in research, development and educational laboratory settings. AKT Endura II is built with a pedestal-mounted loading platform and vacuum enclosure to enable easy loading and unloading of wafer- and target-specific substrates. This design also enables easy transition of parts and components between different processes included in the same etching operation. AMAT Endura II features a low pressure plasma chamber that can be filled with inert gases or other etch-enabling components for complete control over the process. The reactor includes a hybrid gas system which can mix multiple gas streams for optimized etching performance. This system also allows for precise adjustment of deposition pressure, chamber pressure, and etching volume to further tailor the etch process. In addition, the reactor features an integrated mass spectrometer to measure and track etching process characteristics. APPLIED MATERIALS Endura II utilizes RF (radio frequency) and ICP (inductively coupled plasma) technology to deliver high etching rates and uniform etch performance across a wide range of materials. Its advanced power control mechanisms allow for independent DC bias control of both platen and gas systems, ensuring uniform etch depth and uniformity across the wafer. This allows for repeatable and reliable etching results in large volume production. Endura II chamber has a large amount of space which can be used to etch multiple wafers at the same time. This allows for the integration of a number of process steps into a single etch operation, including patterning, cross-linking, and implantation. The reactor also includes a video imaging system to monitor the etching process and show real-time photos of the process. AMAT / APPLIED MATERIALS / AKT Endura II's operating temperature range goes from room temperature to as high as 1000°C (1800°F) under vacuum or nitrogen atmosphere conditions. This high operating temperature range allows for rapid processing of materials, resulting in shorter processing times and fewer defects. In addition, the reactor features a high degree of automation, including programmable recipe parameters, to reduce the effort and time required for setup and start-up. Overall, AKT Endura II is an advanced plasma fusion etching reactor designed to meet the needs of high-volume industrial processes. Its robust design, advanced control mechanisms and high operating temperature range allow for efficient and repeatable etching operations with superior performance.