Used AMAT / APPLIED MATERIALS Endura II #9293626 for sale

AMAT / APPLIED MATERIALS Endura II
ID: 9293626
Wafer Size: 12"
Vintage: 2004
MOCVD System, 12" 2004 vintage.
AMAT / APPLIED MATERIALS / AKT Endura II is a semiconductor etch reactor designed to fabricate advanced nanoscale structures used in a wide range of electronic and optoelectronic devices. This reactor is operated under conditions of high vacuum and low pressure (vacuum up to 1×10−6 Torr). It also features an integrated photoresist etch and a multistep deposition process, as well as advanced control, advanced safety systems, and process monitoring capabilities. The system uses a three-step process to form nanostructures on a wafer: etching, deposition, and post processing. Etching is typically done in a plasma-enhanced chemical vapor deposition (PECVD) system and involves the application of a plasma of reactant ions and radicals to selectively remove material from the wafer. The applied pressure and power of the ions and radicals control the depth of the etch and the size and shape of the structures produced. The apparatus includes an upper and a lower RF chamber, wherein the upper chamber is dedicated to the deposition of materials and contains a source chamber, which is used for depositing material onto the target wafer. The lower RF chamber contains the etch chamber, which is where etching and cleaning operations are conducted. The reactor's transfer mechanism enables the wafer to be moved between the chambers quickly and accurately. The reactor is further equipped with a storage area for ultra-pure gas supplies as well as a temperature-controlled chamber for layering materials in precise layers. This etch reactor offers the user a variety of process parameters, including substrate temperature and RF power. The substrate temperature can be varied from room temperature up to 700 °C, while the RF power can be controlled in a range of 50-600 W. Overall, AKT Endura II is a reliable and versatile etch reactor providing users with the ability to create micro and nanostructures with unprecedented precision. Its internal safety systems, coupled with its highly intuitive operation, make it an ideal tool for any semiconductor fabrication environment.
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