Used AMAT / APPLIED MATERIALS Endura II #9314715 for sale

AMAT / APPLIED MATERIALS / AKT Endura II is a PECVD equipment designed for deposition of dielectric films, metals, and silicides. The system can process 4" wafers at temperatures up to 400°C in an RTP chamber. AKT Endura II reactor has a dedicated loading/unloading station and ancillary equipment enabling substrate temperature and recipe control. It consists of a process chamber, a process head, and a base station. The process chamber is an eight-inch single-wafer process chamber with quartz walls and lid, allowing for processing of silicon, insulating, and conductive materials. The process chamber utilizes the Turbo-Pump Turbo-V AdvanceTM pumping unit for improved cycle times and reliability. It also has a TemperFloTM programmable temperature controller to maintain temperatures inside the reaction chamber. The process head of AMAT Endura II machine contains a set of five electrodes that provide energy for the substrate and process gases. The total power provided for the deposition reaction is 6.75 kW. The heads are designed for flexibility and sequenced reactor operations, allowing for multiple process steps to be performed sequentially. The base station of Endura II tool serves as the control panel for all of the reactor's operations. It contains a series of seven programmable inputs and modes for recipe control, temperature control, and distribution of gases. The asset also features a CCD/camera to monitor chamber conditions during process operations. APPLIED MATERIALS Endura II reactor is an advanced deposition tool designed for a wide variety of applications including semiconductor processes requiring dielectric films, metals, and silicides. It is highly productive and cost effective, allowing process engineers to develop and maintain processes with high yields and optimized cycle times.