Used AMAT / APPLIED MATERIALS Endura II #9315100 for sale

AMAT / APPLIED MATERIALS / AKT Endura II is a state-of-the-art PECVD (Plasma-Enhanced Chemical Vapor Deposition) reactor designed for the production of thin films of dielectric, barrier and protective material coatings, used for semiconductor and thin-film device fabrication. The advanced reactor system is electrically energized to produce a high-energy plasma within a specially-designed vacuum chamber. The plasma, generated by the reactor, creates an ionized gas (plasma) which helps induce dissociation of reactant species within the vapors of the feedstock gases or from the reactant vapor molecules suspended in the chamber itself. Reactive species are then able to penetrate exposed surfaces and nucleate on the substrate surface to form a protective coating. AKT Endura II features several unique benefits. Its two-plate design allows for precise control of temperature and pressure. This eliminates temperature and pressure variations during film deposition and allows for greater repeatability, enabling consistent high-performance films. The automated in-situ end-point monitoring system maximizes reliability and uniformity while reducing cost and downtime. The chamber design of AMAT Endura II provides uniform gas distribution throughout the chamber and high electrical connection characteristics, enabling the deposition of larger area wafers. This also eliminates the need for manual loading, resulting in higher process throughput and high yields. In addition, the PECVD configuration used in Endura II reactor helps maximize throughput by allowing for better control of reactant reactivity, temperature and pressure. It also helps the surface temperature of the wafer to remain homogenous, resulting in better throughput and improved uniformity of thin film deposition. APPLIED MATERIALS Endura II reactor is well-suited for a wide variety of device and thin film deposition applications, providing good process control through precise temperature and pressure control. Its automated in-situ end-point monitoring system eliminates manual loading and provides high-repeatability, enabling the production of consistent high-performance films.