Used AMAT / APPLIED MATERIALS Endura II #9372655 for sale

ID: 9372655
PVD System DT ESC Puck for SLT ESC Part number: 0010-41276.
AMAT / APPLIED MATERIALS / AKT Endura II is a reactor which is designed to be used in advanced semiconductor fabrication processes. It is a physical vapor deposition (PVD) system used in the production of ultra-thin, ultra-small semiconductor films. AKT Endura II is a flexible and versatile reactor that allows for the depositing of multiple materials on a variety of substrates. AMAT Endura II offers a wide range of operational flexibility, making it suitable for the production of many types of thin film devices. The reactor is equipped with several features that enable the deposition of thin films and structures that meet the demanding requirements of modern semiconductor applications. Endura II features a low pressure, sequential lateral solidification (SLATE) process chamber which allows for the deposition of materials using advanced techniques such as alloying, alloying-spreading, and ultra-thin film applications. The SLATE process is capable of operating with up to five different materials simultaneously, allowing for the deposition of structures with complex and engineered interfaces. APPLIED MATERIALS Endura II also features several utilities such as an RF amplifier, generator, and in-situ monitor for real-time process control. The system also features several user-friendly features, such as the ability to pre-program recipes and processes and to easily transfer data from other systems. AMAT / APPLIED MATERIALS / AKT Endura II also supports a wide range of in-situ and ex-situ metrology tools for the characterization of thin films and structures. These tools are capable of measuring film stress, thickness, composition, electrical, optical, and surface characteristics of the thin films. AKT Endura II is a versatile and reliable tool for advanced semiconductor fabrication processes. It is simple to use, and allows for the deposition of materials on a variety of substrates. Its robust design allows for the deposition of thin films with high levels of performance at an economical cost.
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