Used AMAT / APPLIED MATERIALS ENDURA #9078880 for sale
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ID: 9078880
Wafer Size: 8"
PVD system, 8"
(2) Co-Titanium Chamber
101-TiN Chamber
Aluminium / 0.5% Cu Chamber
Pre-clean II Chamber
PVD Style Degas Chamber
Flat Align Chamber.
AMAT/AMAT / APPLIED MATERIALS ENDURA is a semiconductor plasma etch reactor and deposition system. This reactor is used worldwide and is known for its performance and reliability. It is a user-friendly, cost-effective tool for etching and depositing thin films. AMAT ENDURA is built with two distinct subsystems, the plasma source and the process chamber. The plasma source is a magnetron sputtering system, and the process chamber is a multi-cathode reactive ion etcher. This combination provides a versatile wafer processing platform capable of performing high precision dry etching and deposition of multiple materials, as well as enabling advanced material modifications and substrates repair/welding. The process chamber is designed to etch and deposit a wide range of materials, from metals to polymers. A unique feature of APPLIED MATERIALS ENDURA is the provision of multiple etch chambers for the etching of different layers of the wafer. This provides greater control over etch depth and uniformity, allowing for the fabrication of intricate three-dimensional structures. ENDURA utilizes multiple gas sources for the etching and deposition steps. For etching, the reactor can be used with gaseous, liquid or solid surfaces using either oxygen/nitrogen, chlorine/fluorine or rare-gas chemistry. This variety of chemistries helps to optimize etch selectivity, thus ensuring greater stability and reproducibility of device structures. AMAT / APPLIED MATERIALS ENDURA's deposition capabilities are equally impressive, comprising a range of low-temperature processes such as atomic layer deposition, chemical vapor deposition, ultraviolet reactive deposition and ion assisted processes. This allows the deposition of ultra-thin films as well as complex multilayer stacks with great precision. APPLIED MATERIALS/AMAT ENDURA has thus become an important tool in the semiconductor fabrication industry, as its multi-subsystem structure is an excellent example of the integration of etch, deposition and other wafer-processing steps onto the same platform. With its combination of etching and deposition capabilities, APPLIED MATERIALS ENDURA is able to provide the critical precision and control needed for the fabrication of increasingly complex semiconductor devices.
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