Used AMAT / APPLIED MATERIALS ENDURA #9093781 for sale

AMAT / APPLIED MATERIALS ENDURA
ID: 9093781
Wafer Size: 8"
Wide body load lock sets (left and right), 8".
AMAT / APPLIED MATERIALS ENDURA equipment is a cluster-tool platform specifically designed to provide a cost-effective and highly reliable semiconductor production solution. Specifically, AMAT ENDURA platform is used to produce advanced memory, logic, and 3D FinFET technologies with the utmost quality and performance. APPLIED MATERIALS ENDURA system enables customers to achieve an advanced semiconductor process feat that combines the most advanced semiconductor technology with the highest unit reliability and performance. ENDURA is comprised of a comprehensive suite of equipment modules that are designed to serve different segments of the process workflow. This includes deposition, etch and clean, dopant deposition and activation, and via etch. Additionally, it features intelligent thermal control systems and a high throughput front-end cluster that are designed to maximize efficiency and minimize downtime. AMAT / APPLIED MATERIALS ENDURA machine utilizes the highest quality Solid CVD tools and standard Rapid Thermal Process tools for deposition. This ensures the highest quality for each process layer. It also provides the highest degree of uniformity, rigidity, and adherence between process layers to produce production-grade substrates with very thin transistor architectures. AMAT ENDURA tool is also equipped with high-end etch and clean modules including high-performance plasma etch and an LPCVD chamber for post deposition cleaning. Specifically, the etch and clean process enables customers to achieve silicon etch with high selectivity and depth control over epitaxial layers and other thin-film materials used in semiconductor device fabrication. APPLIED MATERIALS ENDURA is also equipped with a high-end dopant deposition and activation asset for impurity incorporation in the device structure. This model uses a proprietary dopant chemistry and thermal activation to achieve near-perfect doping homogeneity for perfect electrical properties and improved device performance. Finally, ENDURA has an innovative dry etch equipment for precision contact-level lithography. This delivers high resolution patterns with sub-lithographic pitch and critical aspect ratio, which is essential in advanced device production.
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