Used AMAT / APPLIED MATERIALS ENDURA #9115932 for sale
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ID: 9115932
Wafer Size: 8"
PCVD System, 8"
Front panel type: Norrow
SMIF: No
SBC Controller: V440
Ion gauges: Nude
Buffer robot: HP
Transfer robot: HP
Blade material: STD
Load lock type: Narrow body
Index handler type: Manual
Loadlock vents type: STD
PVD Chamber details:
Chamber #1
Body type: WIDE
Source type: G12
Power supply: MDX-10K M / MDX-10K S
Heater: STD 4 Finger
Dual TC Amp kit
Pedestal
Target: AL Blank
Gate V/V Type: 2 Position
Short Detect H/W: 0010-20768
Chamber #2
Body type: WIDE
Source type: G12
Power supply: MDX-10K M / MDX-10K S
Heater: STD 4 Finger
Dual TC Amp kit
Pedestal
Target: AL Blank
Gate V/V Type: 2 Position
Short Detect H/W: 0010-20768
Chamber #3
Body type: WIDE
Source type: 12.9 G3
Power supply: MDX-10K M / MDX-10K S
Heater: STD 4 Finger
Dual TC Amp kit
Pedestal
Target: AL Blank
Gate V/V Type: 2 Position
Short Detect H/W: 0010-21940
MFC:
Chamber #1
MFC Type: AERE
Gas: AR
Size: 100, 50
Chamber #2
MFC Type: STEC4400
Gas: N2
Size: 100, 200
Chamber #3
MFC Type: STEC
Gas: N2
Size: 200
Chamber #3
MFC Type: AERA
Gas: N2
Size: 50
Chamber D
MFC Type: SEC-V100
Gas: N2
Size: 200
NESLAB II Chiller
(2) Cyro 9600 Compressors
1998 vintage.
AMAT / APPLIED MATERIALS ENDURA is a chemical vapor deposition (CVD) reactor designed for the deposition of thin, conformal coatings specifically for semiconductor applications. The equipment can also be used for other applications, such as hollow-cathode magnetron sputtering (HCMS) and physical vapor deposition (PVD). AMAT ENDURA is a full-size CVD reactor that uses a plasma-enhanced CVD (PE-CVD) process. PE-CVD enables depositon of significantly thinner, more conformal coatings than traditional batch CVD processes. The system features a horizontal reactor chamber, allowing maximum throughput with limited surface area. Additionally, the chamber flushing and venting unit and large process window allow for use with a wide range of precursor gases. The end-point detection machine of APPLIED MATERIALS ENDURA is designed to deliver highly reliable accuracy in coating thickness readings. An automated process controller, designed specifically for ENDURA reactor, provides precise process control, allowing users to ensure homogenous coating of each substrate. AMAT / APPLIED MATERIALS ENDURA reactor can be further configured with a variety of components, such as gas delivery systems, water-cooled surfaces, and automated loading systems, to customize the tool for specific process applications. For example, additional common components include: a carrier wafer transfer and handling asset, a vacuum model, and an automated wafer mapping equipment. AMAT provides comprehensive service, preventive maintenance programs, spare parts and process training to ensure proper system operation and optimization. In addition to these services, their advanced software and hardware upgrades can help extend the life of the unit significantly. AMAT ENDURA reactor is ideal for high-volume production in the semiconductor industry, as well as for research and development applications. It is easy to operate and offers precise, reliable, and accurate performance for controlled deposition of thin-film coatings.
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