Used AMAT / APPLIED MATERIALS ENDURA #9126392 for sale

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ID: 9126392
Wafer Size: 8"
PVD, 8", L/L: Narrow Buffer/Xfter robot: HP Chamber A: pass Chamber B: cool Chamber E: orienter-degas Chamber F: orienter-degas Ch-1: AlCu Ch-2: AlCu Ch-3: AlCu Ch-4: AlCu AC line voltage: 480V delta AC Full load current: 250A AC Frequency: 60Hz
AMAT / APPLIED MATERIALS ENDURA is a high-powered chemical reactor technology specifically designed for high volume and high throughput semiconductor etch and deposition processes. This versatile equipment provides exceptional chamber design and process control to support the production of complex components. The system is ideal for a wide range of advanced material deposition and etching needs and offers a flexible set of tools. AMAT ENDURA unit is primarily used for chemical vapor deposition (CVD) and etch processes. It utilizes microwaves and radio frequency (RF) to keep the CVD chamber contents in a plasma state. The microwave energy is used to create precursors and radicals, which can then be used to deposit specific target materials on wafers or substrates. The RF energy is used to maintain a uniform plasma and to drive the reaction rate. This ensures a uniform film buildup and high deposition rates. The reactor includes several powerful processing options such as a medium pressure CVD machine, a high pressure CVD tool, a MFC-compatible processing asset, a dynamic microwave exhaust model, an active gas mixing module, and a micro-electro mechanical systems (MEMS) processing chamber. The multi-process equipment is designed to expand the range of material deposition and etching processes available. The system also offers exceptional control and accuracy, allowing users to easily adjust process parameters as needed. APPLIED MATERIALS ENDURA unit utilizes several advanced technologies in order to achieve precise results. It is equipped with a process monitoring machine that uses feedback loops from each chamber to make sure that the entire tool is operating correctly. The asset also includes a mass flow control (MFC) model to ensure precise material flow to the chamber and precise gas flows throughout the equipment. The reactor also features integral temperature control, which can be conveniently adjusted to accommodate different applications. In addition, the scanners and actuators are completely integrated into the system for precise post-processing. This allows for better control and more accurate results. Overall, ENDURA unit is an ideal choice for precise and advanced material etching and deposition processes. It offers excellent process control, an extended range of materials that can be processed, and reliable operation. The machine's versatility and precise temperature control make it a powerful tool for fabricating complex components.
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