Used AMAT / APPLIED MATERIALS ENDURA #9155075 for sale

AMAT / APPLIED MATERIALS ENDURA is an advanced etching and deposition reactor developed by AMAT. The equipment is designed to enable a variety of chemical vapor deposition (CVD) and plasma etching processes of high precision, high uniformity and high throughput for a range of applications in the semiconductor, optical and industrial fields. The system is made up of several components including a process chamber, a load-lock chamber, a source chamber, a transfer chamber and a gas panel. The process chamber is the main part of the unit and houses the process source to provide the source material and reactive gases needed to form the desired process. The load-lock chamber serves to provide a vacuum seal to the process chamber for step loading. The source chamber contains specialty sources for applications such as atomic layer deposition, molecular beam epitaxy and sputtering. The transfer chamber is used to transport and transfer process materials, as well as serve as a buffer between the main process chamber and the load-lock chamber. This chamber and the gas panel are used to monitor and control the pressure, temperature and flow of inert carriers and chemical precursor gases into the process chamber. AMAT ENDURA is designed to provide a precise and stable process environment in a single large reaction chamber. This machine is designed to give superior film properties even during multi-layer process sequences or with difficult deposition materials. With its optimized process control, high-resolution diagnostics and automated process control, APPLIED MATERIALS ENDURA is ideal for a variety of deposition and etching processes that require high levels of performance and repeatability. In terms of process temperature, the temperature range for this tool is from 10°C to 400°C. The pressure range is also adjustable and is from 10-5 Torr to 1.8 Torr. Additionally, the asset is compatible with multiple precursor gases and has an adjustable platen anode for etching processes. In terms of safety, the model incorporates multiple safety sensors to monitor the gas pressure and temperature levels within the chamber. This equipment also has an advanced in-situ cleaning procedure to reduce the amount of chamber re-tune required and prevent issues related to outgassing. In summary, ENDURA is a highly precise and advanced etching and deposition reactor designed to perform CVD and plasma etching processes with high accuracy and throughput. With its adjustable platen anode, safety sensors and automated process control, this system is ideal for a variety of deposition and etching applications.