Used AMAT / APPLIED MATERIALS ENDURA #9157987 for sale
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ID: 9157987
PVD System
Aluminum deposition
Cold aluminum with Ti-TiN
Mainframe: 150mm with tiltout cassettes
Buffer: HP Robot
Transfer: HP Robot
Chamber C: Empty
Chamber D: Empty
Chamber 1: Clamp standard PVD heater, Aluminum 350 C
Magnet part: 0010-20224
Chamber 2: Clamp standard PVD heater, Aluminum 350 C
Magnet part: 0010-20224
Chamber 3: Clamp standard PVD heater, Titanium 100 C
Magnet part: 0010-20221
Chamber 4: TiN 101 pedestal
Magnet part: 0010-20223 or 0040-20129.
AMAT / APPLIED MATERIALS ENDURA is a chemical vapor deposition (CVD) reactor that is typically used for materials manufacturing processes. The equipment works by decomposing a gaseous species at temperatures of up to 1050°C, usually using hexamethyldisilizane (HMDS) as a precursor. The decomposition process generates a vapor phase that is composed of silicon, oxygen, and carbon elements, and these vapor phase particles then interact with the target substrate, resulting in the formation of a thin-film of material onto the substrate. AMAT ENDURA is optimized for maximum flexibility as well as uniform quality of the thin-film deposition. The system is composed of several unit process sections, such as the Prime Station, the Interlocks, and the Substrate Process Controllers. The Prime Station is the central control unit of the reactor, where the operator sets up the parameters of the deposition process, including the reactant species, heater power, temperature, chamber pressure, and substrate temperature. It also monitors the process parameters and has a set of warning indicators when any of the parameters fall out of their settings. The Interlocks are the electronic control devices that are used to monitor the reactor conditions and the substrate process controllers. The Interlocks control the reaction chamber environment through the measurement of temperature, pressure, and gas flow, as well as the motion of the substrate. The Substrate Process Controllers are responsible for maintaining the substrate temperature and uniform coating growth over the substrate by controlling the angular movement of the substrate as well as the flow rate and composition of the reactant gases. The machine also features an extensive collection of auxiliary components that are used to ensure reliable process operation, such as the source tubes, sample feeder, bellows, and bubbler. The source tubes provide the vapor phase chemical precursors to the reaction chamber, while the sample feeder assists in the introduction of solid material into the reaction chamber. The bellow is a combination of an isolator and a temperature measurement device that allows precise temperature control of the reaction chamber. The bubbler also helps introduce reactant gases into the reactor. APPLIED MATERIALS ENDURA is highly efficient, as it is designed to achieve precise control of the thin-film deposition process and reduce the number of substrates that are needed for processing. Furthermore, it is suitable for a wide range of applications, from general semiconductor processing to photovoltaic and optoelectronic device fabrication. Its reliability and flexibility make it a great choice for any type of thin-film deposition process.
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