Used AMAT / APPLIED MATERIALS ENDURA #9174930 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

ID: 9174930
Wafer Size: 12"
Vintage: 2010
PVD System, 12" TiCL4 ALD Processing chamber Gases: L1: Ar (HP) L2: C2H4 (Ethane) L3: H2 L4: He L5: N2 (HP) L6: N2 L7: N2 L8: NH3 L9: SiH4 (Silane) Missing parts: Turbo molecular pump Vacuum fore-line pieces Heated gas delivery lines (Removed as part of decon) Throttle valve Gate valve Process kit (Interior chamber shielding) Chamber to M/F, I/O Cabling 2010 vintage.
AMAT / APPLIED MATERIALS ENDURA is a revolutionary plasma etch reactor designed to enable faster, more precise, more consistent plasma etching in semiconductor and other advanced technology manufacturing processes. This new etch reactor includes a unique and powerful combination of features and capabilities that improve throughput and increase yields. The reactor is built on a single-chamber design, allowing for a number of different processes to be performed in the same equipment, and is designed for flexibility, enabling high-quality etching of a wide range of materials, including poly silicon, poly-imide, poly-silicates, poly-oxides, and nitrides. The system is highly efficient and reliable, with an advanced set of features that provide superior performance while reducing maintenance requirements. It incorporates an independent valve foreline, enabling users to maintain a consistent and repeatable pres- sure and providing better control of the process parameters. Additionally, AMAT ENDURA Plasma Etch Reactor is works well under a number of different chemical and process variations, such as gas chemistry, RF power, pressure, and batch size. APPLIED MATERIALS ENDURA also features an improved version of the existing Automatic Endpoint Detection (AED) unit, designed to allow customers to monitor and control the etching process consistently and with greater accuracy. The AED utilizes feature recognition algorithms that can uniquely identify and classify process endpoints in real-time. This ensures the highest achievable etch rates, with less complexity and reduced risks of downstream contamination. The machine also offers users a number of useful process protection features, such as a remote plasma source shut down, automatic recipe switching for fault conditions, and multiple options for monitoring the process. Together, these safety features ensure superior product quality and consistent performance from tool to asset. ENDURA Plasma Etch Reactor is a complete and powerful solution for advanced processes in semiconductor manufacturing, providing high quality etching results, increased yields and improved efficiency. The features and capabilities of this model make it an ideal choice for any etching application, providing reliable and repeatable performance, with reduced risk and a high degree of process control.
There are no reviews yet