Used AMAT / APPLIED MATERIALS ENDURA #9198496 for sale
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AMAT / APPLIED MATERIALS ENDURA Reactor, or AMAT ENDURA, is a state-of-the-art plasma-enhanced chemical vapor deposition (PECVD) equipment. It is used in semiconductor manufacturing to create high-quality dielectric films, as well as new memory and logic device applications requiring advanced materials. APPLIED MATERIALS ENDURA reactor features a variety of innovative features and capabilities that make it an ideal tool for many advanced film deposition processes. It utilizes a multi-process platform which supports deposition, etch, and implant applications in one system. This allows for an increased number of different wafer materials and processes to be used, making it suitable for a variety of applications. The reactor is designed with on-board digital controllers and a sophisticated vessel loading unit for easy and efficient wafer handling. Its advanced automation capabilities make for easy loading and unloading of wafers and also assist with multiple-layer deposition and etch applications. ENDURA also features an electromechanical film deposition machine that is highly efficient and customizable. It is capable of producing films with high uniformity, improved control and deposition rate, and reasonable power consumption. It also includes an XYZ-axis stage to allow for process automation, including the ability to move the wafer during deposition and etching processes. Additionally, the tool offers Precise RF (Radio Frequency) monitoring allowing users to accurately control RF power as well as monitor the entire deposition process. This enhances process capability, as well as consistency and uniformity of the deposit layer thickness and composition. In addition, AMAT / APPLIED MATERIALS ENDURA also provides in-situ temperature control, enabling the temperature of the process to be accurately monitored and adjusted during production. Overall, AMAT ENDURA Reactor is a powerful deposition asset for semiconductor manufacturing. Its suite of advanced capabilities makes it an ideal tool for creating high-quality dielectric films and other memory and logic device applications requiring advanced materials. This model allows for efficient and controlled processing of various metal and dielectric films and provides consistent quality and uniformity of depositions.
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