Used AMAT / APPLIED MATERIALS ENDURA #9198500 for sale

AMAT / APPLIED MATERIALS ENDURA® Reactor is a specialized piece of equipment designed to perform various chemical processes on a wide range of substrates. This type of reactor is used in the semiconductor, photovoltaic (PV) and thin-film deposition industries to create layers of films on wafers or other flat substrates. AMAT ENDURA® Reactor is capable of performing both chemical vapor deposition (CVD) and physical vapor deposition (PVD) processing. The machine's gas cabinet is equipped with up to 15 process modules, providing flexibility and allowing different gases and chemistries to be used in the same process chamber. Gas delivery and distribution is managed by a sophisticated sequence of valves, orifices and mass flow controllers, ensuring an accurate and uniform supply of gasses required for the process. The substrate is placed into the chamber and heated to the desired temperature before the deposition process begins. After all the gases needed for the process have been introduced, a proper mixture is then achieved using a combination of RF power, gas chemistry and process pressure. The uniformity of the film deposited by the reactor depends heavily on maintaining a uniform pressure and temperature throughout the deposition process. To achieve this uniformity, the reactor is equipped with a quartz viewport with a pyrometer to monitor the substrate temperature. The reactor also uses a combination of active and passive heating methods to ensure a uniform and steady substrate temperature. Active heating methods like RF induction and electron beam linear motion are used to precisely heat the substrate. APPLIED MATERIALS ENDURA® Reactor is a versatile machine, capable of using virtually any process chemistry and optimal reactor conditions for a wide range of applications. This makes it an advantageous choice for customers for essential thin-film deposition processes. The reactor utilizes a combination of RF power, gas chemistry and process pressure to ensure reliable repeatable processing, as well as uniform deposition, layer coverage, and layer thickness.