Used AMAT / APPLIED MATERIALS ENDURA #9198502 for sale

AMAT / APPLIED MATERIALS ENDURA is a multi-chamber co-sputtering equipment that is used to deposit thin films on wafers in the semiconductor industry. It is built to provide low defect, high-quality thin film deposits in order to meet the tight specifications of the semiconductor device manufacturing industry. AMAT ENDURA is capable of deposition at ultra-low temperatures and is used for PVD processes for deposition of dielectric layers on wafers. APPLIED MATERIALS ENDURA consists of two main chambers: the clean chamber and the process chamber. The clean chamber is a low-humidity, ultra-clean environment with a temperature of around 200C. The environment is kept clean by a series of filtration systems, recirculating filters, and ion pumps. It also has a programmable slurry dispenser and a cassette transfer system for loading and unloading wafers. The process chamber is a low-pressure, low-vacuum environment maintained at temperatures between 150C and 250C. The chamber has several ports, including a mechanical arm port, viewport, and laser interferometer port, for monitoring and controlling the deposition process. It contains three sources of deposition material, and a wafer chuck movable between them. The sources can be configured so that different sources can be active at the same time, allowing for multi-layer deposition of materials. ENDURA has an active internal monitoring unit that includes a process monitor, an evaporative leak detector, an open-loop control unit, and a temperature sensor, which are all used to maintain the conditions of the chamber and to ensure deposition quality. The machine also has automated wafer-handling capabilities, as well as a computer-controlled wafer-nesting algorithm, which can be used to optimize the alignment of wafers during processing. AMAT / APPLIED MATERIALS ENDURA is designed to provide versatility, precision, and consistency in thin film deposition. It is capable of producing high-quality thin films, with low levels of contaminants and defects. It can deposit up to five different materials onto a single wafer, with each layer having a different thickness and chemical composition. These features and capabilities make AMAT ENDURA a highly competitive platform for depositing thin films and other materials onto wafers. It is a powerful, reliable, and cost-effective solution for semiconductor device manufacturing operations.