Used AMAT / APPLIED MATERIALS ENDURA #9198513 for sale

AMAT / APPLIED MATERIALS ENDURA
ID: 9198513
CHC I/O Lift assy Part number: 0010-03438.
AMAT / APPLIED MATERIALS ENDURA reactor is a versatile and efficient plasma-enhanced chemical vapor deposition (PECVD) equipment. It is designed to deliver superior process performance and reliability for a wide range of semiconductor device manufacturing applications. AMAT ENDURA enables epitaxial deposition of various metals and dielectrics, gate-oxide formation and deposition of contact layers. It is equipped with an advanced direct-injection plasma source to enable ultra-fast chamber evacuation and uniform plasma density distribution, as well as highly-controlled process temperatures to ensure reliable device performance. APPLIED MATERIALS ENDURA reactor utilizes both PECVD and electron-cyclotron resonance (ECR) technology to deliver superior process control and throughput. The PECVD processes achieves repeatable, uniform deposition of layers with the desired thickness, rate, and undulation through ENDURA's silicone-based precursor delivery system. The ECR technology offers increased process performance and reliability compared to conventional RF sources, with a lower operating cost. It also delivers superior uniformity and improved substrate temperature control without sacrificing throughput. AMAT / APPLIED MATERIALS ENDURA is designed to be extremely flexible, allowing users to easily configure the unit for various applications. Through the use of interchangeable modules and components, the reactor can be customized to meet specific process needs such as additional gas lines and components, variations in the quartz chamber, and source applications. It also features a comprehensive control package that offers a full range of process control and optimization capabilities. AMAT ENDURA utilizes proprietary plasma-based pre-cleaning technology to ensure clean wafer surfaces prior to the deposition process. This pre-cleaning technology removes organic and inorganic contaminants from the wafer surface, allowing for superior results during deposition and etching processes. The pre-cleaning process also reduces the potential for wafer damage that can be associated with wet-cleaning techniques. APPLIED MATERIALS ENDURA reactor is an outstanding machine for PECVD and ECR applications, delivering improved process performance and cost savings. Its high-performance capabilities, flexibility, and process control ensure that users can achieve the desired results in an efficient and reliable manner. With its wide range of capabilities and performance, ENDURA is well-suited for advanced semiconductor device manufacturing applications.
There are no reviews yet