Used AMAT / APPLIED MATERIALS ENDURA #9198516 for sale

AMAT / APPLIED MATERIALS ENDURA Reactor is an advanced plasma deposition system designed for copper-based interconnects and barrier layers used in the manufacture of semiconductor devices. It is a single wafer reactor which incorporates new plasma source technology to ensure uniform layers and greater process control. AMAT ENDURA Reactor features an advanced magnetron dual-source architecture, allowing two different plasma plasmas to be emitted with near equal energy. This provides a high degree of plasma uniformity, with excellent control over the rate of deposition. It also allows for multiple layers to be deposited with each processing step, eliminating the need for etching and other thermal treatments. Its advanced programming capability allows for precise and repeatable deposition to achieve desired results. APPLIED MATERIALS ENDURA Reactor utilizes a variety of deposition materials, including copper, cobalt, tungsten, and various metals, to provide layers for interconnects and circuit pathways. The use of advanced plasma uniformity, high deposition rates, and increased process control enable ENDURA to obtain high quality interconnects rapidly. AMAT / APPLIED MATERIALS ENDURA Reactor is equipped with a powerful plasma-based electron cyclotron resonance ionization source to provide exceptional plasma uniformity and high deposition efficiency. This ensures the extremely uniform deposition of copper and copper alloy layers, and enables the fabrication of advanced copper interconnects. AMAT ENDURA features a gas delivery system that measures the gas flow in real-time and adjusts it accordingly, allowing for a higher degree of control. APPLIED MATERIALS ENDURA Reactor also includes numerous other features, such as a high-performance RF ozone generator, advanced programmability, and user friendly controls that allow for great precision and repeatability. This provides the user with the ability to achieve the highest quality interconnects and circuit pathways in a timely manner. Additionally, ENDURA is designed to be compatible with a variety of substrate materials, improving process flexibility for copper-based materials. Overall, AMAT / APPLIED MATERIALS ENDURA Reactor is an advanced plasma deposition system that provides excellent process control, uniformity, and increased deposition rates for copper-based interconnects and barrier layers. It achieves this through an advanced magnetron dual-source architecture, powerful plasma-based electron cyclotron resonance ionization source, and numerous other features. This makes AMAT ENDURA Reactor ideal for achieving high-quality interconnects and circuit pathways quickly and reliably.