Used AMAT / APPLIED MATERIALS ENDURA #9198545 for sale

AMAT / APPLIED MATERIALS ENDURA
ID: 9198545
Ring edge alumniums Part number: 0021-13290.
AMAT / APPLIED MATERIALS ENDURA® reactor is an advanced physical vapor deposition (PVD) equipment used to coat substrates with thin film materials. This high-performance PVD system provides precision-controlling of process parameters and excellent material utilization, resulting in high throughput and cost savings. The unit delivers consistent excellent performance and reliability. AMAT ENDURA® is comprised of a water-cooled stainless steel chamber that holds a substrate chuck and gas panel assembly. The source materials are held in sealed source containers inside the gas panel. An electron beam evaporator is used to immolate the source materials. The resulting material vapor passes through a diffuser platen and is eventually deposited on the substrate. The gas panel includes a panel heater, an optical viewing window and forward noble gas inlets. To ensure moisture and oxygen free deposition conditions a high purity noble gas is introduced into the chamber prior to deposition. The gases then pass through an integrated mass flow controller (MFC) to precisely control the gas flow and deposition thickness. The electrode substrate chuck is floor mounted and consists of a set of three concentric cylindrical electrodes. They are used to accurately control substrate temperatures as well as for substrate heating and cooling. Moreover, the chuck allows for substrate rotation and movement in the chamber focal plane. APPLIED MATERIALS ENDURA® machine also includes a control module for monitoring the deposition process. The control module consists of a console, software, power supply, interlock tool and pumps. The asset is designed to facilitate easy installation, maintenance and operation while providing an excellent level of control. ENDURA® reactor is a reliable and powerful PVD model. It offers precise material utilization, high throughput and excellent material uniformity. It is an ideal solution for many thin-film deposition applications.
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