Used AMAT / APPLIED MATERIALS ENDURA #9202551 for sale

AMAT / APPLIED MATERIALS ENDURA is a multi-functional equipment designed for reliable, high-performance processing of substrates. It is used in the semiconductor industry for advanced packaging, interconnect and 3D integration processes such as dielectric deposition, metal lift-off, metallization, and dielectric isolation. AMAT ENDURA platform provides excellent uniformity and repeatability while reducing defectivity by eliminating the thermal effects of traditional reactors. APPLIED MATERIALS ENDURA is a fully automated production equipment equipped with multiple process modules. This platform features a high-tech chamber containing a wafer platen and multiple thermal zones. The platen consists of a susceptor, wafer holding ring, and wafer lift pins. This platform is also integrated with a high-efficiency gas delivery system, adjustable nozzles, automated material handlers, vacuum pumps, and RF generators. Additionally, ENDURA unit utilizes advanced process controls to ensure exceptional uniformity and repeatability throughout the process. AMAT / APPLIED MATERIALS ENDURA platform is designed to meet the challenges of CVD, ALD, and PECVD processing. This machine offers high throughput, along with excellent reliability and equipment uptime. The platform is ideal for multistack dielectric deposition for advanced interconnects and memory applications. Additionally, the tool can support various metal deposition processes such as blanket deposition and lift-off. This platform provides efficient, controlled process cooling and layer transfer materials, enabling improved defectivity, thermal stability, and film step coverage. AMAT ENDURA reactor utilizes automated processes to reduce costs and maximize yields. This asset supports substrate sizes ranging from 25mm to 450mm. Its multi-chamber design eliminates the need for manual material handling and enables repeatable processes with minimal variation in thermal loading. Furthermore, APPLIED MATERIALS ENDURA platform features adjustable RF power and frequency settings, allowing users to refine processes for optimal results. ENDURA is a robust, reliable, and multi-functional solution for advanced packaging, interconnect, and 3D integration applications. Its efficient automated processes facilitate maximum throughput and repeatability while ensuring exceptional uniformity and surface quality of substrates. With adjustable RF power settings, a wafer platen, and adjustable nozzles, AMAT / APPLIED MATERIALS ENDURA model is a powerful tool for achieving optimal and consistent performance in various deposition processes.