Used AMAT / APPLIED MATERIALS ENDURA #9202554 for sale

ID: 9202554
System Includes: PVD Chamber Watercool HTHU chamber.
AMAT / APPLIED MATERIALS ENDURA is an advanced chemical-mechanical planarization (CMP) reactor designed specifically for semiconductor manufacturing. It is an important tool for covering, smoothing, and polishing wafer surfaces before device components are deposited. The reactor utilizes an integrated design approach to combine a variety of mechanical and chemical processes into a single equipment. It consists of a dual-zone, rotary-style CMP platform with two 150mm or 200mm platters which rotate in opposite directions independent of each other. The platform is equipped with precision DC-controlled motor drives, programmable power controllers, and an in-situ slurry delivery system. In addition, the platform boasts a sophisticated control unit with powerful data acquisition and real-time capability. This provides advanced stepper control and board setup, allowing multiple recipes and process parameters to be rapidly recalled. This enables high productivity levels, with up to four independent platters and a maximum of 20 bypads per platter. Operators can set up a sequence of up to 16 CMP steps, each with adjustable parameters such as slurry type, pad condition, and pressure settings. The mechanical features of AMAT ENDURA reactor include advanced motion control and damping features, as well as rubber gaskets and a soft cleaning pad machine to ensure wafer contact forces are accurately controlled, leading to uniform and repeatable material removal rates. APPLIED MATERIALS ENDURA reactor also offers high levels of chemical compatibility so that it can be used with a large array of slurries and chemicals for various processes. The chemical portion of the tool includes a series of inline filters to help eradicate unwanted particles as well as an in-line process monitor asset to enable real-time process adjustments. The slurry delivery model is gravity-fed and is regulated by a combination of a programmable power controller and an adjustable speed drive. This allows for full control over slurry flow rate and automated real-time process monitoring and control. ENDURA is a flexible and reliable CMP reactor which offers users the ability to perfom multiple CMP steps with utmost accuracy, efficiency, and repeatability. This tool has been a consistent workhorse for semiconductor advanced development, enabling IC manufacturers to produce higher yields and smaller devices. The powerful control features and motion features enable high levels of precision and repeatability, and the chemical compatibility allows the equipment to be used across a variety of applications.
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