Used AMAT / APPLIED MATERIALS ENDURA #9247381 for sale

AMAT / APPLIED MATERIALS ENDURA reactor is an advanced reactive ion etch (RIE) equipment based on a magnetically-enhanced plasma source. It is a multi-chamber tool that uses a plasma-assisted deposition process to etch (or remove) patterns from substrates and dielectric layers. The system can be used for a variety of process applications such as IC fabrication, contact etch, photoresist stripping and contact hole formation. AMAT ENDURA unit offers users an innovative solution for precise control of the etching process. Its core technology is the magnetic-enhanced plasma (MEP) source. This proprietary technology enables a more repeatable and efficient etching process with higher yields and uniform feature sizes on complex substrates. The magnetized plasma source helps reduce RF electrical noise and enables a broader process window. APPLIED MATERIALS ENDURA machine is designed to provide precise control of etch processes. Its multi-chamber configuration ensures uniformity and cleaning of the wafer surfaces. The dual processing chambers enable the etching process to remain completely isolated from contamination and allow for the use of different gases for efficiently etching different materials. The tool has several advanced capabilities including a wide pressure range (from mTorr to high Torr) for etching challenging dielectrics, a high-resolution quartz mask that allows for precise feature control, and a high-throughput etching process. It also has advanced monitoring and process control systems to provide users with real-time control of the etching process. ENDURA asset can be used in a wide range of industries such as semiconductor, aerospace, medical and automotive. It is designed to enable more precise and efficient etching processes, with reduced risk of substrate damage, contamination and yield loss. The use of the model can also reduce operating costs and enable higher throughput. In conclusion, AMAT / APPLIED MATERIALS ENDURA reactor is a highly advanced and efficient RIE equipment based on magnetic-enhanced plasma technology. It offers users precise control of etch processes on complex substrates, helping to reduce the risk of contamination, substrate damage and yield loss. Additionally, the system is able to provide high-throughput performance, reducing operating costs and increasing profitability.