Used AMAT / APPLIED MATERIALS ENDURA #9263425 for sale

AMAT / APPLIED MATERIALS ENDURA Dual-Acting Reactor is a fused-silica internally cooled plasma reactor specifically designed for CVD processing. This reactor is a state of the art deposition equipment for advanced semiconductor device fabrication. It uses both ultraviolet (UV) and radically-activated plasma to produce a uniform deposition of materials suitable for ultra-thin gate dielectrics and conductive layers. AMAT ENDURA Dual-Acting Reactor is a versatile and highly efficient reactor capable of controlled deposition on substrates up to 300 mm in diameter. It features two separately operated plasma sources, one located at the top of the chamber, and one located at the bottom of the chamber. Both plasma sources can be adjusted independently to control the process parameters and deposition within the process chamber. The top plasma source is a low-temperature silicon nitride, shielded by an aluminum nitride (AlN) window and powered by a 2.4 kW RF generator. The bottom plasma source is an internally cooled, inductively coupled RF power source, with a temperature range from 219-1200 °C. The dual-acting system allows for greater control over the deposition process, enabling users to tune their processes for greater uniformity over larger substrates. Each of the two plasma sources is controlled independently to customize the process, and they can be adjusted in terms of total chamber pressure, plasma power, and source pressure. The reactor also features automation functions, such as automatic shutoff if process parameters are exceeded, which provides users with a more safe and efficient plasma process. APPLIED MATERIALS ENDURA Dual-Acting Reactor features highly reliable substrate and wafer handling components, as well as an advanced robotic motion control system that enables complete automation of the entire processing. This reactor is designed to support optimization of the three main areas of process—reactivity, temperature, and deposition rate. It is highly efficient, requiring low use of materials for deposition, and reduces cost relative to other solutions. ENDURA Dual-Acting Reactor is an innovative, state of the art plasma deposition system that offers excellent uniformity, improved process control and cost savings to the semiconductor industry. With its superior performance and reliable results it is a great choice for advanced applications such as gate dielectric and metal layer deposition. This reactor is well adapted for advanced semiconductor device fabrication, offering maximum throughput and reliability for the most demanding processes.