Used AMAT / APPLIED MATERIALS Front-End Metallization for Endura II #293672286 for sale

AKT/Aktell Endura II Front-End Metallization Reactor is a state-of-the-art reactor that provides an efficient and cost-effective method for integrated circuit (IC) manufacturing. The Endura II offers high yields and a wide process window, allowing device manufacturers to achieve the best production rates. All components are designed to meet stringent requirements for compatibility with leading IC process nodes and control technologies. The Front-End Metallization Reactor utilizes robust physical vapor deposition design principles to provide ultra-thin uniform layers of materials such as aluminum and tungsten. The process starts with a pre-deposition clean to remove any organic residue from the substrate, and prepare it for the deposition of thin films. During the deposition, ultra-high purity metal precursors are rapidly evaporated in a carrier gas and allowed to condense to form a thin film layer on the substrate. The system is integrated with a high-performance vacuum system, allowing competitive cycle times and accuracy. Sensor feedback improves process performance and helps other systems maintain the requirements of sub-50nm processes. The process control includes closed-loop operation for improved process control and yield. Temperature, pressure, and sensitivity are monitored continuously. The Endura II is designed for accurate, fast processing of a wide range of substrates. It can contain up to six substrates at a time and handle substrates from 12mm to 300mm in diameter. With a maximum temperature of 650°C and a maximum speed of 600 RPM, it can be used to achieve high accuracy results in a short amount of time. Additionally, the Endura II supports a wide range of process gases, enabling a variety of deposition recipes. AMAT/Aktell Endura II Front-End Metallization Reactor is a reliable and cost-effective tool for manufacturers who need an efficient solution for IC production. With its versatile design, it can handle a wide range of substrates and process materials. The high performance processing capabilities and process control help manufacturers achieve the best results and meet the demands of challenging device nodes. Thanks to its ability to handle ultra-thin uniform layers, the Endura II is a powerful tool for integrated circuit production.