Used AMAT / APPLIED MATERIALS Front-End Metallization for Endura II #9294263 for sale

AMAT / APPLIED MATERIALS Front-End Metallization for Endura II is an advanced, low-cost, high-performance, high-throughput reactor. It is a fully automated platform that enables the fabrication of front-end integrated circuit (IC) devices, such as application-specific integrated circuits (ASIC) and equipment-on-chip (SoC) devices, with thin-film metalization for significantly improved device performance. This machine combines enhanced process capability, lower operating costs, and improved process preparation with user-friendly automation to enable fast, cost-effective production of semiconductor devices. The Endura II features a unique distributed architecture with enhanced wafer heating and cooling capabilities. The system includes a high-performance multi-station gas box with a graphite susceptor for rapid heating and a powerful vacuum unit for fast cooling. The distributed architecture of the reactor allows for high throughputs of up to 2,700 waffer-hours and 16 wafer planes. The machine features a heated housing, a high-vacuum pressure, and dual-chamber linear gasbox for rapid heating. The gasbox contains an inlet for gases, a graphite susceptor, a plasma generator, a high vacuum, and an exhaust port for gas flow control. AMAT Endura II is equipped with Ultra-High Density Plasma (UHDP) for optimal process compatibility. UHDP is a specialty tool that offers highly efficient cleaning of the wafer surfaces and removal of contaminants, such as metal oxides, from the front-end metallization process. UHDP has been used to achieve efficient plasma-enhanced chemical vapor deposition (PE-CVD) for improved device performance. The Endura II features a fully automated process execution engine that allows for programmable synchronization of the various modules. This feature enables the reactor to precisely control the process parameters, such as temperature, pressure, and gas flow, during each step of the metallization process. The software also incorporates comprehensive asset diagnostics to monitor and control model performance. This ensures enhanced uniformity, improved throughput, and better metallization yields. APPLIED MATERIALS Endura II provides complete solutions for thin-film metalization processes with high-throughput, efficient process preparation, and superior process control. By combining these capabilities with UHDP and automated process control, the reactor enables cost-effective fabrication of semiconductor devices with higher performance and improved yields.