Used AMAT / APPLIED MATERIALS HTHU #185712 for sale

ID: 185712
Wafer Size: 8"
PVD Chamber, 8" HTHU PVD Chamber Hot Aluminum HT MCA+ESC.
AMAT / APPLIED MATERIALS HTHU (High Temperature/High Flux Ultra High Vacuum Reactor) is an ultra-high vacuum deposition equipment developed for advanced research applications. It uses advanced ultra-high vacuum deposition systems that allow for the deposition of thin layers of material onto substrates at temperatures in excess of 1450°C. This makes the system ideal for applications such as growing III-V compound semiconductors, graphene, and boron nitride. AMAT HTHU consists of two main components: the reactor chamber and the evaporation source. The reactor chamber is made of stainless steel and is designed to maintain a vacuum of 1E-6 torr (lower than normal atmospheric pressure). Inside the reactor chamber is the evaporation source, which is used to sputter or evaporate samples of material onto the substrate. An ion gun is also included in the evaporation source, which is used to etch, cleanse, and modify the material on the surface of the substrate. The evaporation source utilizes an RF (radio frequency) power source for material evaporation, which can be switched between e-beam and CVD (chemical vapor deposition). This allows for the control of substrate temperature, flux and pressure during deposition, allowing for the control of material thickness and morphology. Additionally, the extensive control of parameters allows for optimization of the deposition process, increasing the rate of diffusion, enhancing film homogeneity and improving film adhesion. To ensure precision and accuracy during the deposition process, the unit MFC (mass flow controller) is used to adjust the pressure, allowing for a well-controlled flow of mixture gases within the reactor. This combination of temperature and pressure control, as well as a high temperature capability, allows for extremely reliable results. Furthermore, APPLIED MATERIALS HTHU is equipped with a loadlock facility to ensure efficient preparation of the substrates prior to being loaded into the reactor chamber. This feature also allows for rapid cycling of substrates, increasing overall machine throughput. In conclusion, HTHU high temperature/high flux ultra-high vacuum reactor is an advanced deposition tool for research applications. It features advanced RF evaporation, ion etching, and highly accurate temperature, pressure, and flux control capabilities, allowing for complete control of the deposit process. Its loadlock feature allows efficient cycling of substrates, making it highly efficient and reliable.
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