Used AMAT / APPLIED MATERIALS / MOORE 7700 Series #9265323 for sale

AMAT / APPLIED MATERIALS / MOORE 7700 Series Reactor is a process tool commonly used in the semiconductor industry. It is a Vertical Furnace equipment designed for processing wafers of varying sizes, featuring unparalleled temperature uniformity, enhanced wafer throughput, and flexibility. AMAT 7700 Series features an adjustable platform height, allowing operators to adjust the furnace to their process requirements. It has a temperature range of up to 1600°C and excellent temperature uniformity, allowing exact and consistent temperatures across the chamber. Additionally, this system offers a high repeatability for great overall process consistency, no matter the recipe used. The 7850 feature set won AMAT the Fabtech Product of the Year for excellence in engineering, design and functionality. This unit uses a rapid thermal cycling (RTC) technology to reduce the processing times of wafers from even hours to minutes, allowing for greater throughput. Additionally, the machine is flexible in allowing operators to adjust wafer sizes, with compatible wafer sizes ranging from 1 inch to 12 inch wafers. The chamber of MOORE 7700 Series is constructed of stainless steel, with the walls and ceiling of the chamber featuring an innovative ceramic insulation to ensure temperature is retained during operation. This good chamber insulation helps to keep the tool running cooler during operation, while also reducing unnecessary energy usage. The machine utilizes a combination of hot- and cool-gas reactor technology to enable proper thermal flow on the wafers. The 7850 Series additionally features a modular cassette-to-cassette loading technology, allowing for quick and easy loading and unloading of batches of wafers. The tool sensors allow for precise monitoring of the design process in order to give consistent and reproducible performance in demanding processes. In short, APPLIED MATERIALS 7700 Series Reactor is a high-performance tool used in advanced processes. It offers excellent thermal uniformity and repeatability, as well as flexible wafer size and rapid thermal cycling, helping to decrease overall production time. It's modular cassette-to-cassette loading technology and Chamber insulation further add to its overall efficiency and effectiveness.