Used AMAT / APPLIED MATERIALS MxP+ #293749249 for sale

AMAT / APPLIED MATERIALS MxP+ reactor is an innovative plasma-based equipment designed to provide, precise plasma control processes for the development and production of integrated circuits, semiconductors, and optoelectronics. It features advanced, robust plasma control capabilities to ensure wafer processing quality during low pressure and atmospheric pressure plasma etch, sputter, and deposition processes. AMAT MxP+ reactor comprises both a primary and secondary chamber, featuring a unique rotating magnetron source which offers diffractography directly observing the erosion impact, providing both uniformity and repeatability in the plasma processes. In addition, APPLIED MATERIALS MxP+ system boasts integrated, precision process control technologies to help ensure the highest accuracy of etch, deposition and sputtering processes. The device employs internal electrical diagnostics for precision pulse control and modulation during etching of device structures, combined with its rotatable source, allows for the optimization of etch profiles. With an effective reaction chamber, MxP+ reactor is a suitable choice for etching process that require high throughput, precise uniformity, and repeatability. Additionally, the device offers a range of reactive gas, allowing for flexible process control and adjustments. The device also offers flexibility when it comes to chamber cleaning and varying applications. Wall conditioning is available with optional passivation technology, while minimized particle generation helps to ensure a clean plasma environment. AMAT / APPLIED MATERIALS MxP+ reactor is also ideal for sputter processes, as it has a large target area, offers high rates of deposition, and is suitable for a variety of deposition materials, including high aspect ratio structures. Finally, AMAT MxP+ reactor represents an ideal choice when it comes to reactive ion or plasma deposition processes for deposition of thin films, protective coatings, and barrier layers, or for changing the surface energy of the substrate. It easily achieves high deposition rates and is equipped with a stoichiometric control unit ensuring that precursors accurately react with the sub lfabsedsd The ability to perform multi-layer film deposits also facilitates faster device production. In sum, APPLIED MATERIALS MxP+ reactor presents a powerful and reliable machine for a number of device processing applications, thanks to its precise process control technologies, excellent repeatability and uniformity in plasma processes, flexible reactive gas selection, high deposition rates and barrier layer capability.