Used AMAT / APPLIED MATERIALS / NESLAB TiN Chamber for Endura #293660464 for sale

AMAT / APPLIED MATERIALS / NESLAB TiN Chamber for Endura is a versatile, state-of-the-art reactor for the fabrication of materials at an atomic level. This chamber, offering superior chamber-to-chamber uniformity, is capable of delivering uniform films of titanium nitride (TiN), a hard film that is applied to various substrates, using apt Atomic Layer Deposition (ALD). Designed for use with AMAT Endura flagship systems, the TiN Chamber includes easy-to-use features that minimize time-to-exposure and maximize productivity. The TiN Chamber features high-tech software and technologies that offer precision control to substrates of various shapes and sizes during ALD coatings. This superior technology also includes programs that optimize uniformity and target properties of the coated material. The designed TiN Chamber also features superior uniformity, temperature regulation, and great film quality. In addition, this TiN Chamber provides excellent wafer flatness during deposition while also providing excellent heat transfer during the process. The TiN Chamber offers high deposition runs of up to 400 nm per hour without reduce uniformity. NESLAB TiN Chamber for the Endura is the perfect solution for industries and research facilities that require advanced technological solutions for coating substrates with films of TiN. This chamber is ideal for microelectronic and optoelectronic applications, such as research on oxide substrates, oxide semiconductors, optical devices, and more. The TiN Chamber for the Endura equipment is also designed for use with thin films made with element specific precursors. This helps ensure uniform results and uniformity of performance. Furthermore, the TiN Chamber includes an integrated load-lock, allowing multiple wafers to be processed at the same time, thereby maximizing throughput. AMAT TiN Chamber for Endura also offers a host of advanced features, such as a variable gas monitoring system, a gas purging unit for safe substrate processing, hardware components that are built to last, and a highly efficient thermal machine for redistribution across the chamber. To sum up, APPLIED MATERIALS TiN Chamber for the Endura offers reliable and advanced Atomic Layer Deposition (ALD) that provides uniform films of titanium nitride onto various substrates. This chamber is designed to help maximize throughput, reduce time-to-exposure, and ensure uniformity with its integrated load-lock and other features.