Used AMAT / APPLIED MATERIALS P5000 Mark I #9252520 for sale
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ID: 9252520
Wafer Size: 6"
Vintage: 1990
TEOS System, 6"
Oxide covers
Thermal type
(3) DLH
1990 vintage.
AMAT / APPLIED MATERIALS P5000 Mark I is a state-of-the-art Dry Etch Reactor designed for advanced semiconductor processing. It is ideal for high-precision processing of sensitive materials such as metals, polymers, or insulators. This reactor is designed to provide superior wafer etching performance due to its advanced design and construction. At the heart of the equipment is a unique plasma source that enables the production of nanometer-precise particulate-controlled plasma. This advanced technology produces the highest quality uniform etch profiles and better feature control when patterns are defined with harsh material problems. AMAT P5000 Mark I also has a fully automated control system that provides repeatable etch processes with high yields. APPLIED MATERIALS P5000 Mark I also features an innovative chamber design that enables increased productivity without compromising stability or performance. It has a low-temperature body, an adjustable source power, and an efficient gas supply structure. This ensures that the chamber has superior uniformity, low particle density, and a significantly improved etch rate. P5000 Mark I also has a proprietary low temperature chamber liner unit, allowing the chamber to reach temperatures of just 20-30 degrees Celsius. This machine also ensures better thermal uniformity, resulting in higher plasma densities and enhanced high-precision etching. AMAT / APPLIED MATERIALS P5000 Mark I also offers a high-performance loader that supports a wide range of parts, even those with high levels of contamination. Finally, this tool has exceptional diagnostics capabilities and can identify and report on various parameters, helping to quickly and efficiently diagnose any performance concerns and quickly resolve them. In conclusion, AMAT P5000 Mark I is a high-performance advanced etch reactor that provides superior wafer processing performance, with enhanced feature control and improved etch yields. It is equipped with a unique plasma source, an efficient gas supply, and a low-temperature chamber liner asset, allowing it to produce highly-uniform, nanometer-precision plasmas. It also has excellent diagnostics capabilities and a high-performance loader that supports a wide range of parts.
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