Used AMAT / APPLIED MATERIALS P5000 Mark II #9044020 for sale
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ID: 9044020
Oxide etch system, 8"
Includes:
Process: 40 oxide
Software version: l4.70b
System power rating: 208VAC, 3 phase
Loading configuration: 2 cassette handler configuration
(2) MxP chambers
Model: MxP poly
Esc type: Electrostatic
1torr manometer: MKS 127aa-00001b
Chamber dry pump model and size: Ebara A30W
Loadlock dry pump model and size: Ebara A10S
Turbo pump model and size + controller: Alcatel ATH400M
Cathode chiller model: amat hx+150 CHX TC-300
Wall chiller model: AMAT0
EP system: monochrometer
Heater stack/gate valve: standard
RF generator model: ENI OEM-12B
RF match model: hybrid RF match
IHC manometer: 10 torr manometer
IHC mfc size: 20 sccm
High voltage module: sharing between chamber A/B
Remote components:
(2) Dry scrubber cabinets
AMAT 0 HX. Power rating: 208VAC, Chemicals used: Glycol.
(2) Neslab CHX chillers, Power rating: 208VAC, Chemicals used: Glycol
1992 vintage.
AMAT / APPLIED MATERIALS P5000 Mark II is a revolutionary reactor designed for chemical processing in the semiconductor industry. It is built with a chemical vapor deposition (CVD) equipment that allows for isotropic dry etching of wafer surfaces without the need for wet chemical etching. The Mark II also boasts a unique dual-chamber design that enables it to run two different processes simultaneously - one in each chamber. This increases the efficiency of the entire process cycle, while providing higher yields and reducing cycle times. AMAT P5000 Mark II is equipped with two reaction chambers, each of which are gas-tight, temperature-controlled, and fed by independent power supplies. Additionally, the chamber features a high-end inert atmosphere, which allows for a variety of process chemistries, including oxygen and plasma-based etching. These reaction chambers are constructed of a high-temperature-resistant stainless steel, which ensures superior performance even in extreme processing conditions. Additionally, the chambers are capable of accommodating a wide range of susceptor sizes. APPLIED MATERIALS P 5000 MARK II also offers an advanced temperature control system for precise temperature settings. This unit is equipped with a temperature controller, data collection machine, and programmable logic controller (PLC) for process control. Furthermore, the P5000 offers multiple safety features, such as gas line shutoff switches and emergency stop buttons, to ensure process safety. In terms of deposition technologies, P 5000 MARK II provides the capability to deposit thin films in the 750-nm to 1.5-micron range. It also offers superior crystal quality, uniformity, and repeatability, along with a high-temperature deposition environment that ensures superior process control and yield. Furthermore, it allows for compatibility with Low Pressure Chemical Vapor Deposition (LPCVD) and Atomic Layer Deposition (ALD) processes. To sum it up, P5000 Mark II is an advanced semiconductor processing tool that boasts superior performance and process control. Its unique dual-chamber design and advanced temperature control asset make it ideal for many different kinds of high-performance processes. Additionally, its flexibility and performance make it an excellent choice for use in various semiconductor production settings.
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