Used AMAT / APPLIED MATERIALS P5000 Mark II #9200059 for sale

A unique reactor for semiconductor wafer processing is AMAT / APPLIED MATERIALS P5000 Mark II. This tool is one of the most advanced ultra-high density plasma reactors available for chip etching and deposit processes. It contains up-to-date, advanced processing elements in an optimized system layout, including a capacitively coupled plasma (CCP) source, a high-field swept coil in the plasma source, an inductively coupled plasma (ICP) source, and a high-resolution gas-flow distributor. The high-performance Mark II has many features that make it ideal for challenging etching jobs. AMAT P5000 Mark II is a dual RF plasma source system with a microwave powered ICP source and a capacitively coupled planar (CCP) source. The ICP source utilizes a wideband sweep coil that provides extremely high power density, enabling high etch rates even in deep features and high aspect ratio structures. The CCP source provides an electron shower to maintain uniform coverage of the wafer, even during process changes such as increases in wafer size, changes in wafer thickness, etc. The high-field swept coil in the plasma source of APPLIED MATERIALS P 5000 MARK II, together with the microwave plasma source, helps to provide the highest deposition rates available today. This feature enables the deposition of extremely smooth, even coatings which can reach depths of several hundred nanometers. The coil is adjustable, allowing process engineers to fine tune the deposition rate to meet their specific needs. An additional great feature of AMAT P 5000 MARK II is its high-resolution gas-flow distributor. This advanced feature helps to ensure a uniform and controllable flow of gases and reactants to the plasma chamber, so that all parts of the wafer are exposed to the same uniform and desired plasma conditions. This ensures the wafer processes can be completed in short time periods and at a level of uniformity that traditional manual processes cannot achieve. APPLIED MATERIALS P5000 Mark II is the ultimate ultra-high density plasma reactor available for chip etching and deposit processes. Its numerous high-performance features include a wideband swept coil, a microwave powered ICP source, and a high-resolution gas-flow distributor, allowing for precise process control. Its optimized system layout ensures uniform coverage and is useful for high aspect ratio structures and large wafer sizes. Overall, AMAT / APPLIED MATERIALS P 5000 MARK II reactor is a cutting edge tool and an excellent choice for challenging etching jobs.